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A kind of release agent and its preparation method and application in epoxy resin potting

A technology of release agent and dispersant, which is applied in the field of release process of epoxy resin encapsulation, can solve the problems of volatilized pollutants, human health hazards, unsuitable for aerospace products, etc., and achieves good heat resistance and easy process. , the effect of good demoulding effect

Active Publication Date: 2018-11-23
XIAN INSTITUE OF SPACE RADIO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the release agent products of the above patents contain silicone oil, grease, ester, fatty acid and other materials, which will volatilize pollutants under thermal vacuum conditions
Some specific aerospace products contain components that are sensitive to volatile pollutants, so the existing release agents containing silicone oil, grease, esters, fatty acids and other materials are not suitable for aerospace products
The mold release agent that also uses Teflon material as the mold release material will use compressed gas to spray out Teflon powder during use, which will cause harm to human health.

Method used

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  • A kind of release agent and its preparation method and application in epoxy resin potting
  • A kind of release agent and its preparation method and application in epoxy resin potting

Examples

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preparation example Construction

[0047] A preparation method of release agent, the steps of the method comprising:

[0048] The first step, surface activation of inorganic nanoparticles:

[0049] Mix inorganic nanoparticles with an average particle size of 10-50nm and hydrogen peroxide aqueous solution under ultrasonic conditions, and then reflux under stirring conditions to obtain a mixture, centrifuge the obtained mixture, take the precipitate, and then The precipitate is ultrasonically cleaned with deionized water, and then centrifuged. Repeat the ultrasonic cleaning with deionized water and centrifugal separation for 3-5 times to obtain nanoparticles activated by surface hydroxyl groups;

[0050] The inorganic nanoparticles are one or a mixture of nano-silica, nano-zirconia, nano-titanium dioxide, nano-alumina, nano-zinc oxide, and nano-tin oxide;

[0051] The mass concentration of the hydrogen peroxide aqueous solution is 30%, the mass ratio of the inorganic nanoparticles to the hydrogen peroxide aqueou...

Embodiment 1

[0071] Weigh 10 g of nano-silica (average particle size is 30 nm), 100 g of 30 wt % aqueous hydrogen peroxide solution, add them to a 250 ml ground-mouth Erlenmeyer flask, ultrasonically treat for 15 min, transfer the dispersion to a 250 ml single-necked round-bottomed flask, and pack Put on the serpentine condenser, stir and reflux at 90°C for 6 hours to obtain mixture A for later use; centrifuge mixture A at 12000r / min for 8 minutes to obtain a precipitate, wash the precipitate with 100ml deionized water under ultrasonic conditions, and then Centrifuge at 12000r / min for 8min to obtain a precipitate, repeat the "washing-centrifugation" operation 4 times for this precipitate, each time for ultrasonic cleaning for 30s, vacuum dry at 70°C for 10h to obtain a mixture B, and set aside;

[0072] Weigh 5g of perfluorodecyltrimethoxysilane, 100g of absolute ethanol, 40g of deionized water, and 1g of glacial acetic acid, add them into a 250ml ground-mouth Erlenmeyer flask, ultrasonicat...

Embodiment 2

[0077] Weigh 10g of nano-alumina (average particle size is 40nm) and 80g of 30wt% aqueous hydrogen peroxide solution, add them into a 250ml ground-mouth Erlenmeyer flask, ultrasonically treat for 20min, transfer the dispersion to a 250ml single-necked round-bottomed flask, load Serpentine condenser, stirred and refluxed at 90°C for 8 hours to obtain mixture A for later use; centrifuged mixture A at 10,000 r / min for 10 minutes to obtain a precipitate, washed the precipitate with 90ml deionized water under ultrasonic conditions, and then in Centrifuge at 10000r / min for 10min to obtain a precipitate, repeat the "washing-centrifugation" operation 3 times for this precipitate, each time for ultrasonic cleaning for 40s, vacuum dry at 70°C for 10h to obtain a mixture B, and set aside;

[0078] Weigh 4g of hexamethyldisilazane, 120g of absolute ethanol, 40g of deionized water, and 1.6g of glacial acetic acid, add them into a 250ml ground-mouth Erlenmeyer flask, ultrasonicate for 10min,...

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Abstract

The invention relates to a releasing agent and a preparation method and an application thereof to filling epoxy resin, and particularly relates to a releasing agent containing hydrophobic nano particles and a preparation method and an application thereof to filling epoxy resin, which belong to the technical field of releasing processes for filling epoxy resin. According to the soluble releasing agent containing the hydrophobic nano particles, preparation raw materials are cheap and easy to obtain, a preparation process is simple, and a releasing method is simple; after a dispersing agent of a solution film obtained by brushing or spraying the releasing agent is completely volatilized, an obtained solid continuous thin layer formed by the hydrophobic nano particles has a good releasing effect, an effective releasing purpose can be achieved only by using a simple manual releasing method, epoxy products and dies are not polluted or damaged, effective components of the releasing agent have good heat resistance, and the drying time is short.

Description

technical field [0001] The present invention relates to a kind of releasing agent and its preparation method and the application in epoxy resin encapsulation, especially relate to a kind of release agent containing hydrophobic nanoparticles and its preparation method and the application in epoxy resin encapsulation, The invention belongs to the technical field of demoulding process of epoxy resin potting, and particularly relates to the application in the reinforcement of aerospace high-voltage electronic products and the improvement of the electric strength of aerospace electronic products. Background technique [0002] Aerospace high-voltage electronic products, because the circuit in the high-voltage module has the characteristics of large local potential difference and complex electric field distribution, the usual electrical installation method will cause high-voltage ignition problems, and the potting process is generally used to replace it with solid media. Air is fil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C33/60
CPCB29C33/60
Inventor 刘智伟郝海燕范传强冯野峰白德鹏朱海郑成君张志成
Owner XIAN INSTITUE OF SPACE RADIO TECH