Ultra-thin heat dissipation film and preparation method thereof

A heat dissipation film, ultra-thin technology, applied in the field of ultra-thin heat dissipation film and its production, can solve the problems of increased thermal resistance, unfavorable use, difficulty in punching graphite pressed materials, etc., achieve high thermal conductivity and heat dissipation performance, easy to process and use, excellent The effect of thermal performance

Active Publication Date: 2017-05-10
广州宏庆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Graphite material has excellent thermal conductivity, but it is difficult to process and use directly. Generally, it needs to be bonded with adhesives. Adding an adhesive layer with low thermal conductivity (generally thermal conductivity lower than 1W / K / m) will inevitably lead to a substantial increase in thermal resistance, thus The excellent thermal conductivity of graphite materials is shielded
At the same time, it is difficult for graphite material pressed products to be ultra-thin and resistant to bending, so they do not have flexible properties, and the punching of graphite pressed materials is very difficult and not conducive to use, and the yield rate is low

Method used

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  • Ultra-thin heat dissipation film and preparation method thereof
  • Ultra-thin heat dissipation film and preparation method thereof
  • Ultra-thin heat dissipation film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Such as figure 1As shown, the ultra-thin heat dissipation film of the present invention includes a heat dissipation layer group 1 and a protective film layer 2 sequentially from the inside to the outside, wherein the heat dissipation layer group includes a heat dissipation adhesive film layer 11 and a heat dissipation metal film layer 12 .

[0062] 1. Make heat dissipation layer group

[0063] 1.1 Preparation of thermal adhesive film layer

[0064] 1) Preparation of magnetized high thermal conductivity powder

[0065] The carbonyl method commonly used in this field is used to cover the surface of the graphite powder with magnetic nickel to form a nickel-coated graphite powder material. That is, under the conditions of normal pressure and 40-100 ° C, carbon monoxide reacts with active metal nickel to form nickel carbonyl, and then the formed nickel carbonyl is circulated through the thermal decomposer repeatedly, so that the carbonyl is continuously deposited on the su...

Embodiment 2

[0091] Such as figure 2 As shown, the ultra-thin heat dissipation film of the present invention includes an adhesive layer 3 , a heat dissipation layer group 1 , and a protective film layer 2 sequentially from the inside to the outside.

[0092] 1. Make heat dissipation layer group

[0093] 1.1 Preparation of thermal adhesive film layer

[0094] 1) Preparation of magnetized high thermal conductivity powder

[0095] The carbonyl method commonly used in this field is used to cover the surface of the graphite powder with magnetic nickel to form a nickel-coated graphite powder material. That is, under the conditions of normal pressure and 40-100 ° C, carbon monoxide reacts with active metal nickel to form nickel carbonyl, and then the formed nickel carbonyl is circulated through the thermal decomposer repeatedly, so that the carbonyl is continuously deposited on the surface of the original graphite powder particles Decompose and deposit on it to produce high-purity nickel-coat...

Embodiment 3

[0114] Such as image 3 As shown, the ultra-thin heat dissipation film of the present invention includes heat dissipation layer group 1, adhesive layer 3, heat dissipation layer group 1, and protective film layer 2 sequentially from inside to outside.

[0115] Except for repeating step 2 of embodiment 2 to prepare three stacked heat dissipation layer groups, other steps are the same as embodiment 1.

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Abstract

The invention discloses an ultra-thin heat dissipation film and a preparation method thereof, and relates to the field of electronic materials. The heat dissipation film comprises an upper protective film layer, a lower protective film layer, and at least one heat dissipation layer group positioned between the upper protective film layer and the lower protective film layer, wherein the heat dissipation layer group comprises a heat dissipation metal film layer and a heat dissipation rubber film layer which is overlaid on the heat dissipation metal film layer and is used for transferring heat transversely. The heat dissipation film provided by the invention is easy to operate, and is suitable for various electronic products and communication equipment; a formed film layer is light, thin and dense.

Description

technical field [0001] The invention belongs to the field of electronic materials, in particular to an ultra-thin heat dissipation film and a manufacturing method thereof. Background technique [0002] With the rapid development of the electronics industry, the development of small, light, and thin mobile phones, and the replacement of display panels, especially the rise of OLEDs, all internal materials are required to be flexible, resistant to bending, and thin, light, and easy to use. Processing, low cost, especially the higher and higher requirements for heat dissipation. [0003] At present, graphite materials (including artificial graphite, natural graphite and graphene) are mainly used, which are bonded by adhesives. Graphite material has excellent thermal conductivity, but it is difficult to process and use directly. Generally, it needs to be bonded with adhesives. Adding an adhesive layer with low thermal conductivity (generally thermal conductivity lower than 1W / K / ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B15/04B32B37/12
CPCB32B9/007B32B9/04B32B15/04B32B37/12B32B2037/243B32B2250/40B32B2255/06B32B2255/20B32B2255/205B32B2307/302B32B2307/558
Inventor 郑永德祝琼
Owner 广州宏庆电子有限公司
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