A kind of nano-type multi-layer composite conductive adhesive film and its manufacturing method

Abstract

The invention relates to a nano multilayer composite conductive adhesive film which comprises a first conductive adhesive layer, a nano layer, a second conductive adhesive layer and a release film layer. The nano layer comprises rare earth, polyaniline, organic solvents and additives besides nano particles. The nano layer additionally arranged between the first conductive adhesive layer and the second conductive adhesive layer is made under high-temperature high-pressure conditions and is stable in performance, resistant to high temperature and corrosion, high in conductivity and remarkable in electromagnetic wave shielding performance, electrical resistivity is 0.37omega.cm<2>, and an electromagnetic wave shielding rate is up to 90.23%, so that the conductive adhesive film with the nano layer has great conductivity, electromagnetic wave shielding performance and mechanical strength. The nano multilayer composite conductive adhesive film has excellent performances such as low electrical resistivity, excellent electromagnetic wave shielding performance and high conductivity. In addition, product structural simplicity is achieved, a manufacturing method is simple, and high processability is realized.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesive films, and more specifically relates to a novel multi-layer heterosquare conductive adhesive film. Background technique [0002] Anisotropic conductive adhesive is a special coating material that is coated and bonded between the substrate a and the substrate b, and the current can only flow between the substrates a and b from the direction of the vertical axis z. It has the functions of unidirectional conduction and glue fixing, which can solve some subtle wire connection problems that cannot be handled by previous connectors. [0003] At present, the main components of anisotropic conductive adhesive include resin adhesive and conductive particles. The function of the resin adhesive is not only moisture proof, but also heat resistance and insulation. It is mainly to fix the relative position of the electrode between the ic chip and the substrate. In terms of conductive particles, th...

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Problems solved by technology

Although the conductivity of the anisotropic conductive adhesive will increase with the increase of the filling rate of the conductive particles, it will also increase the probability of the conductive particles contacting each other to cause a short circuit, which will affect the conductive properties.

At the same time, there are also requirements on the particle size. Large conductive particles will reduce the number of particles in contact with each electrode, and it is also easy to cause short circuit due to contact between conductive particles of adjacent electrodes; too small conductive particles are likely to cause particle aggregation, resulting in Particle distribution density is uneven, electromagnetic wave shielding is poor, resistivity is high, conductivity is poor, and this kind of conductive film has the disadvantages of easy deformation, inconvenient transportation and storage due to the lack of support layer.

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