A high power solid-state laser thermal management system

Abstract

The invention discloses a high-power solid laser thermal management system. The high-power solid laser thermal management system comprises a first cooling cavity, a first liquid charging cavity, a second liquid charging cavity and a second cooling cavity which are connected in sequence, wherein a first refrigerating unit, the first cooling cavity and the first liquid charging cavity and a second refrigerating unit, the second cooling cavity and the second liquid charging cavity adopt a symmetrical structure which takes a laser gain medium as a center axis; the liquid charging cavity in any one side of the symmetrical structure is filled with liquid metal; the heat of the laser gain medium is transferred to the liquid metal through heat conduction; the cooling cavities are filled with refrigerating mediums; the refrigerating mediums are subjected to phase change in the cooling cavities to absorb the heat transferred to the cooling cavities through the liquid metal; and the refrigerating units cool the refrigerating mediums which are subjected to phase change to be lower than a melting point and enable the refrigerating mediums to enter the cooling cavities again. By adoption of the high-power solid laser thermal management system, the problem of mismatch between a soldering flux and gain medium thermal expansion coefficient in the conventional welding process is eliminated; and in addition, the heat of the laser gain medium can be dissipated to the outside environment to the maximum degree.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a high-power solid-state laser thermal management system. Background technique [0002] In a high-power solid-state laser system, most of the pump light absorbed by the laser gain medium is converted into waste heat and deposited inside the gain medium, resulting in an increase in the temperature of the gain medium. Due to the external cooling and the characteristics of the Gaussian distribution of the pump light, there is a large temperature gradient inside the gain medium, and the corresponding thermal stress and strain, as well as the change in the refractive index of the gain medium, will eventually lead to a decrease in laser output power and a decrease in beam quality. . In the development of lasers, thermal effects have always been a major obstacle restricting the development of lasers in the direction of ultra-high power and high-quality beam quality. [0003] Worldwid...

AI Technical Summary

Problems solved by technology

The problem that has always been insurmountable in this method is that a specific solder is required for soldering, and the thermal expansion coefficient of the solder cannot exactly match the gain medium, and the contact thermal resistance of the soldering is far beyond the acceptable range, so new thermal interface materials and thermal Packaging technology and more efficient heat dissipation methods to meet the needs of laser cooling

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