Double-sided packaging method of slab laser crystal

A laser crystal and packaging method technology, applied in the field of lasers, can solve the problems of aggravating thermal effects, large-area virtual welding, affecting the beam quality and reliability of solid-state lasers, etc., and achieves the effect of eliminating air and reducing the generation of holes

Active Publication Date: 2017-05-10
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
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  • Claims
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AI Technical Summary

Problems solved by technology

This method can reduce the thermal resistance of the slab laser crystal and the heat sink to a certain extent, but the solder layer is prone to large-sized voids (≥1mm 2 ) and a large area of ​​virtual soldering, when a large pump power is injected, the thermal effect is aggravated, resulting in serious thermal lensing, thermal-induced stress birefringence, thermal-induced diffraction damage, thermal-induced crystal fragmentation, etc., directly affecting the solid-state laser. Beam Quality and Reliability

Method used

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  • Double-sided packaging method of slab laser crystal
  • Double-sided packaging method of slab laser crystal

Examples

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example 1

[0037] The double-sided encapsulation method of slab laser crystal in the example 1 comprises the following steps:

[0038] (1) From bottom to top, heat sink 1, gold-tin solder sheet and aluminum alloy thickness control sheet, gold-tin solder column, Nd:YAG slab laser crystal are placed in sequence from bottom to top, and the welding body 1 is composed of the above; the Nd: The size of the YAG slab laser crystal is 3mm×40mm×140mm, the optical film thickness of the Nd:YAG slab laser crystal is 4μm, the metal titanium film thickness is 300nm, the platinum film thickness is 300nm, and the gold film thickness is 800nm; The thickness of the sheet is 120μm, and the area is 38mm×126mm; the thickness of the aluminum alloy thickness control sheet is 80μm, the height of the gold-tin soldering post is 120μm; the thickness of the heat-sink gold film is 500nm.

[0039] (2) Put the welding body 1 into the vacuum welding furnace, and evacuate the vacuum welding furnace to 6×10 -3 Pa, the we...

example 2

[0043] The double-sided encapsulation method of slab laser crystal in the example 1 comprises the following steps:

[0044] (1) Place the heat sink 1 with the welding surface upward, the gold-tin solder sheet and the aluminum alloy thickness control sheet, the gold-tin solder column, and the Yb:YAG slab laser crystal from bottom to top, and the above constitute the welded body 1; where Yb:YAG The size of the slab laser crystal is 1.3mm×10mm×50mm, the optical film thickness of the Yb:YAG slab laser crystal is 3μm, the metal titanium film thickness is 100nm, the platinum film thickness is 300nm, and the gold film thickness is 500nm. The thickness of the gold-tin solder sheet is 100 μm, and the area is 9mm×48mm; the thickness of the aluminum alloy thickness control sheet is 60 μm; the height of the gold-tin solder column is 120 μm; the thickness of the heat-sink gold film is 400nm.

[0045] (2) Put the welding body 1 into the vacuum welding furnace, and evacuate the vacuum weldin...

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Abstract

The invention discloses a double-sided packaging method of a slab laser crystal. The method comprises the following steps that an upper heat sink of which the welding surface is upward, a gold and tin welding sheet, a gold and tin welding column and the slab laser crystal are arranged in turn from the bottom to the top so as to from a first welding body, wherein a first thickness control piece is arranged at the edge of the gold and tin welding sheet in a way of being fit with the gold and tin welding sheet; the first welding body is welded so as to obtain a semi-finished product; a lower heat sink of which the welding surface is upward, an indium bump and the semi-finished product are arranged in turn from the bottom to the top so as to from a second welding body, wherein one side of the semi-finished slab laser crystal is downward, an indium layer is plated on the welding surface of the lower heat sink, and a second thickness control piece is arranged at the edge of the indium layer; and the second welding body is welded so as to obtain the slab laser crystal. With application of the technical scheme, the problems that large-size holes and large-area pseudo welding are liable to occur on the welding layer can be solved.

Description

technical field [0001] The invention relates to the field of lasers, in particular to a double-sided packaging method for lath laser crystals. Background technique [0002] Large-size slab laser crystals for solid-state lasers (≥100mm 2 ) generates a lot of heat during work, so that the temperature of the slab laser crystal itself rises rapidly. If the heat is not taken away in time, it will directly lead to the performance degradation and rupture of the slab laser crystal. Therefore, the slab laser crystal must be cooled. [0003] At present, the heat dissipation methods of the slab laser crystal mainly include: plating indium or gold-tin alloy solder on the welding surface of the upper and lower heat sinks, clamping the slab laser crystal, and then heating the clamped slab laser crystal module welding. This method can reduce the thermal resistance of the slab laser crystal and the heat sink to a certain extent, but the solder layer is prone to large-sized voids (≥1mm 2 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/042H01S3/16
CPCH01S3/0405H01S3/042H01S3/16
Inventor 陈露刘磊梁兴波唐晓军王超刘洋王文涛吕坤鹏
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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