Multilayer structure flexible electronic continuous compounding system

Abstract

The invention belongs to the field of multilayer structure flexible electronic compound machining, and discloses a multilayer structure flexible electronic continuous compounding system. The multilayer flexible electronic continuous compounding system comprises four coiling-uncoiling modules, a primary lamination die cutting module, a rotation step pitch module, a secondary lamination die cutting module, a waste rejection module and a tag coiling module, and the internal constitutions and mutual connection manners of the modules are designed. Moreover, an optimal research result is given for the process principles of lamination die cutting control, tension control and the like of the system. By adopting the multilayer flexible electronic continuous compounding system, free switching among a plurality of working condition modes can be realized according to required working conditions, meanwhile single compounding, yield detection, waste rejection, rectification, high-accuracy die cutting and continuous feeding can be satisfied effectively, and the functions of good tension control and the like are ensured.

Description

technical field [0001] The invention belongs to the related field of multi-layer structure flexible electronic compound processing, and more specifically relates to a multi-layer structure flexible electronic continuous compound system. Background technique [0002] Multilayer structure flexible electronics is usually a composite structure of multilayer film, which consists of antenna, chip, adhesive layer, backing paper and face paper. Therefore, in the production process of multi-layer structure flexible electronics, the problem of multi-layer film lamination is involved, and the corresponding realization of the precise positioning of each layer of film is the key to the efficient production of labels; at the same time, the production of multi-layer structure flexible electronics is generally It is carried out by the roll-to-roll process, which ensures that the substrate maintains a relatively stable tension during the transmission process: too much tension may cause the s...

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Problems solved by technology

[0004] However, further studies have shown that the above-mentioned existing equipment still has the following defects or deficiencies: First, they often do not contain tension control and deviation correction devices, which cannot achieve stable film tension during the winding and unwinding process, and cannot perform high-precision die-cutting ; Secondly, this type of existing equipment can only compound the situation that the core layer and the face paper have the same step distance, and cannot meet the demand when performing the step-to-step operation; finally, the function of the existing equipment is relatively single, and it cannot meet the multi-layer structure simultaneously. Various complex working conditions in the process of flexible electronic compounding, and there are various problems such as complex composition structure, inconvenient operation and low efficiency

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