Heat transfer system driven by piezoelectricity and applied to self-priming liquid heat exchanger and heat transfer method thereof

A piezoelectric drive and heat transfer system technology, applied in the field of heat transfer enhancement, can solve the problems of many mechanical pump transmission parts, large energy loss, low integration, etc., to improve integration, reduce operating noise, and improve heat transfer. The effect of efficiency

Active Publication Date: 2017-05-17
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: in the heat transfer system of the partition heat exchanger, due to the directional circulation flow of the working medium in the heat source circuit and the cold source circuit, it is necessary to connect external mechanical pumps in series respectively, and the mechanical pumps have many transmission parts. , high energy loss, high working noise, and large volume, etc., resulting in low integration and difficulty in miniaturization; at the same time, connecting an external mechanical pump in series to realize fluid drive is not conducive to the heat transfer system to improve the heat transfer efficiency of the heat exchanger

Method used

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  • Heat transfer system driven by piezoelectricity and applied to self-priming liquid heat exchanger and heat transfer method thereof
  • Heat transfer system driven by piezoelectricity and applied to self-priming liquid heat exchanger and heat transfer method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] In the heat transfer system used, the thickness of the piezoelectric ceramic sheet is 0.05mm; the thickness of the metal sheet is 0.1mm; the material of the elastic sealing film is silica gel, and the thickness is 0.5mm; It is triangular, with a cross-sectional size of 0.2mm and a groove depth of 0.2mm; the cooling element is a combination of fins and fans; the above-mentioned piezoelectric-driven self-priming liquid heat exchanger heat transfer system is used for heat transfer.

[0044] (1) Inject and fill the self-priming liquid heat exchanger 1, the heat source pipeline 6, and the cold source pipeline 13 with the working medium 12, which is the refrigerant FC-72;

[0045] (2) Connect the piezoelectric ceramic sheet 17 in the self-priming liquid heat exchanger 1 to the AC power supply 3, the waveform of the AC power supply 3 is a sinusoidal function, the frequency of the AC power supply 3 is 1000 Hz, and the voltage of the AC power supply 3 is 220V;

[0046] (3) Under...

Embodiment 2

[0052] In the heat transfer system used, the thickness of the piezoelectric ceramic sheet is 1 mm; the thickness of the metal sheet is 0.5 mm; the material of the elastic sealing film is polydimethylsiloxane (PDMS), and the thickness is 2 mm; the enhanced heat transfer structure It is an array column, the column section is circular, the diameter is 0.5mm, and the height is 2mm; the heat dissipation element is a combination of fins and fans; the above-mentioned self-priming liquid heat exchanger heat transfer system driven by piezoelectricity is used for heat transfer. ,

[0053] (1) Inject and fill the self-priming liquid heat exchanger 1, the heat source pipeline 6, and the cold source pipeline 13 with the working medium 12, and the working medium is ethanol;

[0054] (2) Connect the piezoelectric ceramic sheet 17 in the self-priming liquid heat exchanger 1 to the AC power supply 3, the waveform of the AC power supply 3 is a rectangular wave, the frequency of the AC power sup...

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Abstract

The invention discloses a heat transfer system driven by piezoelectricity and applied to a self-priming liquid heat exchanger and a heat transfer method of the heat transfer system driven by the piezoelectricity and applied to the self-priming liquid heat exchanger. The heat transfer system driven by the piezoelectricity and applied to the self-priming liquid heat exchanger comprises the self-priming liquid heat exchanger (1), an alternating-current power source (3), a heat source pipeline (6), one-way valves (7), a cold source pipeline (13) and a heat dissipation element (14). The self-priming liquid heat exchanger (1) comprises a piezoelectric vibration partition plate (2), a heat source heat exchange cavity (8), an enhanced heat transfer structure (9), a heat transfer partition plate (10) and a cold source heat exchange cavity (11). According to the heat transfer method of the heat transfer system driven by the piezoelectricity and applied to the self-priming liquid heat exchanger, the piezoelectric vibration partition plate (2) generates periodic vibration under the action of the alternative-current power source (3) to change the volumes of the heat source heat exchange cavity (8) and the cold source heat exchange cavity (11), and a working medium conducts directional circular flow to conduct heat exchange under the blockage function of the one-way valves (7) and the function of periodic vibration. By the adoption of the heat transfer system driven by the piezoelectricity and applied to the self-priming liquid heat exchanger, a liquid drive device in the heat transfer system is simplified, the heat exchange efficiency is improved, and the heat dissipation requirement of a tiny electronic element in a limited space is met.

Description

technical field [0001] The invention relates to the field of enhanced heat transfer, in particular to a piezoelectric-driven self-suction liquid heat exchanger heat transfer system and a heat transfer method thereof. Background technique [0002] In a traditional liquid cooling system circuit, the heat exchanger does not have the role of liquid drive. The directional circulation flow of the working medium in the heat source circuit and the cold source circuit is mainly driven by a mechanical pump connected in series in the pipeline. Because the mechanical pump has many shortcomings such as large volume and high working noise, it is not conducive to the miniaturization of the heat dissipation system and restricts the integration of the heat dissipation system. On the other hand, with the continuous improvement of miniaturization and integration of electronic manufacturing technology, the calorific value per unit volume has increased sharply. Taking computer CPU as an example...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/00
CPCF28D15/00
Inventor 林庆宏李宗涛汤勇李志陈凯航陈钧驰袁伟
Owner SOUTH CHINA UNIV OF TECH
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