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Flat plate type LED lead frame

A lead frame and flat-plate technology, which is applied in the field of flat-plate LED lead frames, can solve the problems of complex manufacturing process, complex heat dissipation structure, and low heat conduction efficiency, and achieve the effects of simple manufacturing process, simple heat dissipation structure, and high heat conduction efficiency

Inactive Publication Date: 2017-05-24
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ceramic LED lead frame with the above structure has the following disadvantages: 1. Due to the complex manufacturing process of ceramics, the production cost of the existing ceramic LED lead frame is high and the production efficiency is low
2. Since the thermal conductivity of ceramics is poorer than that of metals, the ceramic LED lead frame needs to transmit heat out through copper sheets, conductors, and copper sheets. Because of its complex heat dissipation structure, its heat conduction efficiency is low, so only LED lead frame with low output power can be produced
3. Since the LED chip of the existing ceramic LED lead frame is in the bowl, the light emitted by it is easily blocked by the bowl, so that the light emitting angle is small

Method used

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  • Flat plate type LED lead frame
  • Flat plate type LED lead frame
  • Flat plate type LED lead frame

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0015] Such as figure 1 As shown, a flat LED lead frame of the present invention includes a plurality of frame units 2 for carrying LED chips 1, and a channel 3 is provided between two adjacent frame units 2; in this embodiment, adjacent A connection block 8 is provided between the two frame units 2, but the connection block 8 can be broken; an epoxy resin block 4 is provided in the channel 3; each frame unit 2 includes two pieces of copper sheet, and the two copper sheets are connected by an epoxy resin sheet 5 . In this embodiment, the epoxy resin block 4 and the epoxy resin sheet 5 are molded at one time.

[0016] The two copper sheets are composed of the first copper sheet 6 and the second copper sheet 7, the area of ​​the first copper sheet 6 is greater than or equal to the area of ​​the second copper sheet 7, that is, the area of ​​the ...

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Abstract

The invention discloses a flat plate type LED lead frame which comprises multiple frame units (2) for bearing LED chips (1). A channel (3) is arranged between two adjacent frame units (2). The channel (3) is internally provided with an epoxy resin block (4). Each of the frame units (2) comprises two copper pieces which are connected through an epoxy resin sheet (5). The flat plate type LED lead frame has the advantages of simple manufacturing process, high heat conduction efficiency, and the guarantee of a large irritation angle of a light source.

Description

technical field [0001] The invention relates to a lead frame, in particular to a flat LED lead frame. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that realizes the electrical connection between the lead-out end of the internal circuit of the chip and the external lead by means of bonding materials to form an electrical circuit. It plays the role of a bridge connecting with external wires. Most of the semiconductor integrated blocks need to use lead frames, which is an important basic material in the electronic information industry. [0003] The flat LED lead frame of the prior art is a ceramic LED lead frame, which is made of ceramics. A copper sheet for the positive electrode and a copper sheet for the negative electrode are provided on the upper and lower ends of the ceramic inside the flat plate. A through hole is provided for the conductor, and the two copper sheets for the positive electrode and...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/64
CPCH01L33/62H01L33/647
Inventor 曹光伟李泓张继桉金琦峰
Owner NINGBO KANGQIANG ELECTRONICS CO LTD