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Solder alloy and package structure using same

A technology of solder alloy and structure, applied in the direction of welding/cutting media/materials, assembling printed circuits with electrical components, welding media, etc., can solve problems such as disconnection and solder joint cracks, and achieve sufficient reliability.

Active Publication Date: 2017-05-24
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the strain caused by the difference in coefficient of linear expansion among constituent parts by repeated loads may cause cracks in the solder joint, which may eventually lead to disconnection

Method used

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  • Solder alloy and package structure using same
  • Solder alloy and package structure using same
  • Solder alloy and package structure using same

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Embodiment Construction

[0029] Before describing the embodiments of the present invention, problems in conventional solder alloys will be briefly described. The number of electronic devices mounted on automobiles is increasing day by day, but it is difficult to secure a mounting space for electronic devices in the limited space of automobiles. Therefore, the space is relatively enlarged by miniaturization of the electronic equipment, or the electronic equipment is installed in a place where the temperature becomes high and therefore the mounting is controlled conventionally from the viewpoint of reliability, such as an engine room. As a result of these, an increase in the heat generation density of electronic equipment due to miniaturization and an increase in ambient temperature occur, and the electronic equipment is exposed to higher temperatures. Furthermore, in order to cope with the evolution of future electronic equipment, it is necessary to exhibit high reliability, such as heat resistance, ev...

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Abstract

A solder alloy which contains from 0.5% by mass to 1.25% by mass (inclusive) of Sb, In in an amount satisfying 5.5 <= [In] <= 5.50 plus 1.06[Sb] in cases where 0.5 <=[Sb] <= 1.0, while satisfying 5.5 <= [In] <= 6.35 plus 0.212[Sb] in cases where 1.; [Sb] <=1.25 (in the formulae, [Sb] represents the Sb content (mass%) and [In] represents the In content (mass%)), from 0.5% by mass to 1.2% by mass (inclusive) of Cu, from 0.1% by mass to 3.0% by mass (inclusive) of Bi and from 1.0% by mass to 4.0% by mass (inclusive) of Ag, with the balance made up of Sn.

Description

technical field [0001] The present invention mainly relates to a solder alloy used for soldering electronic components to an electronic circuit board and a mounting structure using the same. Background technique [0002] Electronic control of automobiles is progressing from the viewpoints of automobile safety, comfort, impact on the environment, and the like. Electronic devices mounted in automobiles require high reliability against loads such as heat, vibration, and impact of the automobile. [0003] In response to such requirements for automotive electronic equipment, solder alloys used for mounting circuit boards of automotive electronic equipment need to be highly reliable. Solder alloys have a lower melting point than printed circuit boards or electronic parts of the parts to be joined, and therefore their mechanical properties are significantly degraded in a high-temperature environment. In addition, since the modulus of elasticity of the solder alloy is also small, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00H05K3/34
CPCC22C13/00H05K3/34H05K3/3463B23K35/025B23K35/262C22C13/02H05K1/181H05K3/3485Y02P70/50H05K1/09H05K3/3457H05K2201/032
Inventor 日根清裕古泽彰男北浦秀敏
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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