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Immobilizing membrane for circuit board and printed circuit board

A technology of curing film and circuit board, which is applied in the fields of printed circuit manufacturing, printed circuit, and secondary treatment of printed circuit, etc. It can solve the problems of high adhesion between plastic base material and conductor layer, and achieve excellent substrate protection performance, Effect of improving adhesion and improving heat resistance

Inactive Publication Date: 2017-05-31
惠州市大亚湾科翔科技电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the cured film for wiring boards cured by irradiation with active energy rays as described above, especially the composition for printed wiring boards suitable for the method of curing ink immediately after printing, both plastic substrates and Adhesion and high hardness on the conductor layer are difficult

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0012] A cured film for circuit boards, consisting of the following components in parts by weight: 1.3-3.3 methyl methacrylate homopolymer, 5-8 methyl methacrylate-n-butyl acrylate copolymer, methyl methacrylate - Isooctyl acrylate copolymer 2-4.3, polyvinylpyrrolidone 14-19, diethylene glycol dimethacrylate 1.5-3, acrylamide 2-4, diethylene glycol dimethacrylate 1 -3, N-Aspartyl Chlorin 4-7, Dexaporphyrin 10-14, BeO 2-4, Al 2 o 3 3-7, tributyl phosphate 3-7, diethylene glycol diacetate 3-5, polyacrylic acid 1.5-3.5, lauryl amidopropyl betaine 1-4, 5-aminolevulinic acid 1-4, meta -Tetrahydroxyphenylchlorins 1-3.

[0013] Further, the cured film for circuit boards is composed of the following compon...

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PUM

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Abstract

The invention provides an immobilizing membrane for a circuit board and a printed circuit board. Through the immobilizing membrane for a circuit board, a plastic substrate and conductor circuit metal can be endowed with excellent sealability and high hardness. The immobilizing membrane for the circuit board can perform an excellent substrate protection property, contains a thermocuring component, and can further enhance sealability and heat resistance. The printed circuit board has high sealability and high heat resistance.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a cured film for a circuit board and a printed circuit board. Background technique [0002] As a method of forming a resist film, a solder resist film, a symbol mark, etc. on a printed wiring board, a method of using an ink containing a curable composition and curing the ink by irradiation with active energy rays is known. [0003] However, various cured films for wiring boards such as resist ink and marking ink formed on printed wiring boards are required to maintain various properties such as resistance to soldering heat, and are required to have high adhesion and high adhesion to plastic substrates and conductor layers. hardness. However, in the cured film for wiring boards cured by irradiation with active energy rays as described above, especially the composition for printed wiring boards suitable for the method of curing ink immediately after printing, bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/02C09D4/06C09D7/12G03F7/09H05K3/28
CPCC09D4/06C09D5/18C09D7/61C09D7/63G03F7/09H05K3/282
Inventor 张富治陈锦华付建云
Owner 惠州市大亚湾科翔科技电路板有限公司