Micro-nano measure equipment high precision high response elasticity reed manufacturing method
A technology of measuring equipment and elastic reeds, which is applied in the direction of measuring devices, techniques for producing decorative surface effects, microstructure technology, etc., can solve problems such as low processing efficiency, expensive equipment, and affecting dimensional accuracy, and improve processing costs. , low equipment price, simple process effect
Inactive Publication Date: 2017-05-31
HEFEI UNIV OF TECH
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Problems solved by technology
[0005] Wire cutting processing has the following disadvantages: 1. Wire cutting processing will produce vibration when processing very thin workpieces, which will affect the processing accuracy; 2. It will easily deform during processing and affect dimensional accuracy; 3. High temperature will be generated during processing, which will affect elasticity. Reed performance; 4. High processing cost, difficult to process complex patterns, etc.
The MEMS manufacturing process has the following shortcomings: 1. High processing cost; 2. Low processing efficiency; 3. The process is complicated and difficult to operate
Photolithography technology has the following disadvantages: 1. Expensive equipment and high cost; 2. The process is complicated and difficult to operate; 3. The etching efficiency is low
Method used
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Embodiment 1
[0041] Such as figure 1 As shown, in this embodiment, a 0.1mm-thick beryllium-copper alloy high-sensitivity elastic reed for a micro-nano three-dimensional coordinate measuring machine contact probe is processed according to the following steps.
[0042] (1) Design pattern: Design the pattern of the elastic mechanism according to the needs. The pattern of the elastic mechanism is as follows: figure 2 shown.
[0043] (2) film printing: print the elastic mechanism pattern on the film with a film printer, and set the elastic mechanism pattern part as negative color;
[0044] (3) Surface treatment of the beryllium copper sheet: cut the beryllium copper sheet according to the pattern size of the elastic mechanism, then polish the two sides of the cut beryllium copper sheet with water abrasive paper, and wipe off the powder on the surface after polishing; then put the polished beryllium copper sheet Soak it in SanNy 3111 copper surface polishing solution for 30 seconds, take it o...
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Abstract
The invention discloses a micro-nano measure equipment high precision high response elasticity reed manufacturing method characterized by using a chemical etching mode to make a high response elastic reed; the method includes the following 9 steps: pattern design, film printing, beryllium copper sheet surface treatment, light sensitive surface coating, light sensitive surface reinforcing, exposure, development, corrosion and stripping. Compared with a convention method, the micro-nano measure equipment high precision high response elasticity reed manufacturing method is low in cost, simple in method, easy to realize, and can easily process the elastic reed with complex patterns; the performance parameters (circularity, linearity, edge roughness) of the elastic reed processed by the method is better than that of the elastic reed processed by the conventional method.
Description
technical field [0001] The invention relates to the field of making elastic reeds required for micro-nano measuring equipment, in particular to the field of making elastic reeds of micro-nano measuring probes. Background technique [0002] In the field of micro-nano measurement, there are many tiny quantities that need to be measured, such as micro-size, micro-displacement, micro-vibration, micro-strain, etc. The elastic reed is the key part of the micro-measurement instrument, and is often used to sense the signal for transmission, conversion, amplification, etc. The accuracy (such as dimensional accuracy, edge uniformity, surface flatness, etc.) and sensitivity of the elastic reed directly affect the accuracy, sensitivity, and resolution indicators of the micro-measurement instrument. For example, the probe of a micro-nano three-dimensional coordinate measuring machine is composed of an elastic mechanism and a three-dimensional sensor. The elastic mechanism is composed of...
Claims
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IPC IPC(8): G01B11/27G01B11/24G01B11/30B81C1/00
CPCG01B11/27B81C1/00182G01B11/2408G01B11/306
Inventor 李瑞君王鹏宇李丹东何亚雄范光照
Owner HEFEI UNIV OF TECH