A method for preparing metal network transparent conductive electrodes by plasma bombardment
A transparent conductive electrode, plasma technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve problems such as hidden safety hazards, low market competitiveness, waste of precious metals, etc., to achieve diversification and small production capacity restrictions , the effect of low input cost
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Embodiment 1
[0048] like Figure 1-5 As shown, this embodiment provides a method for preparing a metal network transparent conductive electrode by plasma bombardment. It includes five main steps: one is the selective fixation of the substrate and the removable layer, the other is the deposition of cracking fluid and cracks into a template, the third is the formation of metal network grooves by plasma bombardment, and the fourth is the formation of nano-metal particles. The coating and annealing form a network, and the fifth is UV curing and compaction to control the surface morphology and obtain transparent conductive electrodes.
[0049] The detailed process of each step is as follows:
[0050] (1) Selection and fixation of substrate and removable layer
[0051] (1) The selected substrate material is PET, 5cm×5cm, cleaned with a spray gun, including spraying twice with acetone, twice with ethanol, and three times with deionized water, and then blown dry with nitrogen to keep it clean; ...
Embodiment 2
[0070] like Figure 1-5 As shown, the method for preparing a metal network transparent conductive electrode by plasma bombardment provided in this embodiment includes the following steps:
[0071] The detailed process of each step is as follows:
[0072] (1) Selection and fixation of substrate and removable layer
[0073] (1) The selected substrate material is PET, 5cm×5cm, cleaned with a spray gun, including cleaning twice with acetone, twice with ethanol, and three times with deionized water, and then dried with nitrogen to keep it clean;
[0074] (2) The selected removable layer is photoresist 3, SU-8 negative photoresist, which is evenly sprayed on the substrate, and a Meyer rod 2 with a diameter of 10 mm and a wet film thickness of 15 μm is rolled at a constant speed to form a film. In oven 1, keep warm at 150°C for 6 minutes. Set the power of the ultraviolet lamp 11 to 1000W, and expose at a height of 10 cm vertically above the sample for 10 seconds to obtain a photor...
Embodiment 3
[0092] like Figure 1-5 As shown, the method for preparing a metal network transparent conductive electrode by plasma bombardment provided in this embodiment includes the following steps:
[0093] The detailed process of each step is as follows:
[0094] (1) Selection and fixation of substrate and removable layer
[0095] (1) The selected substrate material is glass, 5cm×5cm, cleaned with a spray gun, including cleaning twice with acetone, twice with ethanol, and three times with deionized water, and then dried with nitrogen to keep it clean;
[0096] (2) The selected removable layer is photoresist 3, BN303-60 negative photoresist, which is evenly sprayed on the substrate, and the Meyer rod 2 with a diameter of 10 mm and a wet film thickness of 6 μm is rolled at a constant speed to form a film , in oven 1, keep warm at 20°C for 4min, set UV lamp 11, power 100W, and expose at a height of 10cm vertically above the sample for 30s; repeat the above steps 5 times to obtain photor...
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Abstract
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