TR module vertical interconnecting structural member

A technology of vertical interconnection and structural parts, which is applied in the structural connection of printed circuits, the structural connection of antenna grounding switches, electrical components, etc., can solve the problems of low yield, low production efficiency, poor productivity, etc. High yield, high rework efficiency, and improved reliability

Active Publication Date: 2017-05-31
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the existing vertical interconnection method of TR modules using fur buttons, the reliability of the interconnection is not high, and when multiple high-density interconnections are required, the productivity is poor, the production efficiency is low, and the yield rate is not high. And technical problems with low repair efficiency

Method used

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  • TR module vertical interconnecting structural member
  • TR module vertical interconnecting structural member
  • TR module vertical interconnecting structural member

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Embodiment Construction

[0018] The present invention will be further described in detail below in combination with specific embodiments. However, it should not be understood that the scope of the above subject matter of the present invention is limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

[0019] Such as figure 1 The structure schematic diagram of the embodiment of the present invention is shown; wherein, the TR module vertical interconnection structure of the present invention includes a PCB board 1 , a dielectric board 2 and a substrate 3 , and the dielectric board 2 is located between the PCB board 1 and the substrate 3 . In the vertical interconnection structure of the TR module of the present invention, the PCB board 1 , the dielectric board 2 and the base board 3 are fixed together by external clips.

[0020] Specifically, the PCB board 1 is provided with a metallized hole for we...

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Abstract

The invention discloses a TR module vertical interconnecting structural member. An annular fuzz button is mounted in a mounting groove of a substrate and fixedly connected with a conductive thin film on the undersurface of the mounting groove, and a needle head of an insulator mounted on a PCB (printed circuit board) passes a positioning hole of a dielectric board and then is inserted into an inner hole of the annular fuzz button; hole diameter of the inner hole of the annular fuzz button is smaller than outer diameter of the needle head of the insulator, the annular fuzz button has elasticity, and after the needle head of the insulator is inserted into the inner hole of the annular fuzz button, the annular fuzz button elastically deforms, compresses the needle head of the insulator and closely contacts with the same, so that interconnecting reliability is improved. Elastic deformation is caused by when the needle head of the insulator is inserted into the annular fuzz button and not caused by extrusion of the PCB and the substrate, so that producibility is better during high-density interconnecting, production efficiency and yield are higher, repair efficiency is high, and damage to or falling loss of the fuzz button caused by separation of upper and lower boards is avoided.

Description

technical field [0001] The invention relates to the technical field of phased array antennas, in particular to a TR module circuit connection component. Background technique [0002] With the development of phased array antenna technology, it has been widely used in communication, radar, navigation and other fields. As a key component of phased array antenna, TR module has become a key factor restricting its performance, volume, price and manufacturability. At present, the vertical interconnection of circuits in TR modules has become a general method for reducing size and increasing integration. Specifically, the upper and lower PCB boards and LTCC substrates are used to extrude the vertical buttons and dielectric boards in the middle to achieve their electrical properties. The connection, the fur button is placed vertically in the direction of the Z axis. [0003] However, the fur button is small in size and is easy to be squeezed and deformed as an elastic device. When i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/50H01Q21/00H01Q23/00H05K1/14
CPCH01Q1/50H01Q21/00H01Q23/00H05K1/144Y02E10/50
Inventor 黎颖丁卓富符博管玉静孙思成
Owner 成都雷电微力科技股份有限公司
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