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Heat radiation device of electronic component

A heat dissipation device and electronic component technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of expensive ceramic heat sinks, increased anti-interference, high cost, etc., and achieve the benefits of sending and receiving, preventing electric shocks, and prolonging service life. Effect

Pending Publication Date: 2017-05-31
WUJIANG XUWEI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It takes a lot of money to prevent interference or increase the size of electrical appliances to keep the radiator away from the antenna; ceramic heat sinks are expensive and costly

Method used

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  • Heat radiation device of electronic component
  • Heat radiation device of electronic component
  • Heat radiation device of electronic component

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Experimental program
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Effect test

Embodiment Construction

[0016] Attached below figure 1 , 2 , 3, 4 and 5 further illustrate the present invention. attached figure 1 , 2 , 3, 4 and 5 schematically show the heat dissipation device for electronic components of the present invention. The heat dissipation device is a composite structure, which is respectively the heat conduction mechanism of the inner layer and the heat dissipation plastic 2 of the outer layer. The heat conduction mechanism is a metal sheet 1 or The heat pipe 6, the metal sheet is a copper sheet or an aluminum sheet. The heat dissipation device has a square structure and is provided with a plurality of heat dissipation fins 3 , and the plurality of heat dissipation fins 3 are criss-crossed to form grooves 4 . At least one positioning mechanism 5 is provided on the edge of the heat sink, and the positioning mechanism 5 is a screw hole and a cooperating bolt or a screw hole and a cooperating plastic elastic screw.

[0017] According to needs, the cooling device has on...

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PUM

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Abstract

The invention discloses a heat radiation device of an electronic component, and the heat radiation device is simple in technology, resistant to electromagnetic interference and low in cost. The heat radiation device of a composite structure includes a heat conduction mechanism in the inner layer and heat radiation plastics in the outer layer, the heat conduction mechanism includes metal sheets or heat conduction tubes, the metal sheets are copper or aluminum sheets, the heat radiation device of a square structure is provided with radiating fins, the radiating fins are arranged in a vertically and horizontally staggered way to form grooves, and the edge of the heat radiation device is provided with at least one positioning mechanism. The heat radiation plastics have high heat absorption and a horizontal heat radiation function but almost no conductive performance, so that electromagnetic waves are not generated; compared with a heat radiator of pure metal in the same size, metal in the heat radiation device is lighter, and the cost is reduced effectively; the insulation performance is high; and electromagnetic wave interference generated in heat radiation of metal is avoided effectively, and convenience is provided for signal transmitting and receiving.

Description

technical field [0001] The invention belongs to the field of radiators, in particular to a radiator for electronic components. Background technique [0002] Electronic components have a certain loss during operation, and most of the loss becomes heat. If no heat dissipation measures are taken, the temperature may reach or exceed the allowable junction temperature, and the device will be damaged. Household appliances such as CPUs in computers and routers, power tubes in TVs, row tubes, power amplifier tubes in power amplifiers, and electronic components in industrial appliances all need a large number of radiators, so cooling devices must be added. [0003] The most commonly used method is to install heat dissipation devices for electronic devices, use radiators to radiate heat to the surrounding space, and add cooling fans if necessary to strengthen cooling and heat dissipation with a certain wind speed. At present, aluminum alloy and ceramic radiators are commonly used. Th...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 孙清稳
Owner WUJIANG XUWEI ELECTRONICS TECH CO LTD