Preprocessing device before printing of silicon chip in preparation process of solar cell

A technology for solar cells and pretreatment devices, applied in sustainable manufacturing/processing, circuits, photovoltaic power generation, etc., can solve the problems of easy residual foreign matter, poor cooling and cleaning effect on silicon wafers, etc. , the effect of good printing performance

Active Publication Date: 2017-06-06
EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the problem of poor cooling and cleaning effect before printing of silicon wafers in the prior art, and the problem that foreign matter is easy to remain on the silicon wafers, a pretreatment of silicon wafers before printing in the solar cell production process is now provided. device

Method used

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  • Preprocessing device before printing of silicon chip in preparation process of solar cell
  • Preprocessing device before printing of silicon chip in preparation process of solar cell

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Embodiment 1

[0020] Such as figure 1 and 2 As shown, a pretreatment device for silicon wafers before printing in the solar cell production process includes a first belt conveyor 1 and a second belt conveyor 2, and the first belt conveyor 1 and the second belt conveyor 2 are arranged between There is a bracket 3, a platform 4 is arranged on the top of the bracket 3, a turntable 5 is rotatably connected to the platform 4, a motor 6 is fixed on the lower surface of the platform 4, the output end of the motor 6 is fixedly connected with the turntable 5, and the lower surface of the turntable 5 is arranged symmetrically There are a first cylinder 7 and a second cylinder 8, the extending ends of the first cylinder 7 and the second cylinder 8 face downward, and the extending ends of the first cylinder 7 and the second cylinder 8 are fixed with a rotary cylinder 9, and the rotary cylinder The output end of 9 is fixed with struts 10, the lower surface of struts 10 is fixed with a number of suction...

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PUM

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Abstract

The invention relates to the technical field of preparation of solar cells, and specifically relates to a preprocessing device before printing of a silicon chip in a preparation process of the solar cell. The device comprises a first belt conveying apparatus and a second belt conveying apparatus, a support is arranged between the first belt conveying apparatus and the second belt conveying apparatus, the top end of the support is provided with a platform, the platform is rotatably connected with a rotating disc, the lower surface of the rotating disc is symmetrically provided with a first cylinder and a second cylinder, rotary cylinders are both fixed at extending ends of the first cylinder and the second cylinder, the lower surfaces of support rods are provided with a plurality of sucking discs, and a side of the support is provided with a fan. According to the device, the silicon chips conveyed by the first belt conveying apparatus can be preprocessed through the setting of a falling curtain, the sucking discs can smoothly adsorb the silicon chips on the first belt conveying apparatus, the probability that a screen is punctured is reduced, the temperature of the surfaces of the silicon chips can be greatly reduced, the volatilization rate of slurry organic matters in the screen is reduced, and good printing performance can be maintained.

Description

technical field [0001] The invention relates to the technical field of solar battery sheet preparation, in particular to a silicon wafer pre-printing pretreatment device in the solar battery sheet preparation process. Background technique [0002] The preparation process of crystalline silicon solar cells mainly includes: cleaning, removing damaged layer, texturing, diffusion junction, etching, deposition of anti-reflection film, printing, sintering, cell test. Among them, printing is an important process in the production process of crystalline silicon solar cells. When the silicon wafer is transported to the printing process in the previous process of printing, the temperature of the silicon wafer itself is high and foreign matter is easy to adhere to the surface. On the one hand, if the surface of the silicon wafer has Impurities are easy to puncture the screen or crack the silicon wafer, and the service life of the screen will have a great impact on the production cost. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683H01L31/18
CPCH01L31/1804H01L21/67028H01L21/67109H01L21/67703H01L21/6838Y02E10/547Y02P70/50
Inventor 孙铁囤姚伟忠汤平
Owner EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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