Adhesive dispensing and laminating machine for fingerprint recognition component

Abstract

The invention discloses an adhesive dispensing and laminating machine for a fingerprint recognition component. The adhesive dispensing and laminating machine comprises a rack, a material supplying and receiving mechanism, a transporting mechanism, an adhesive dispensing mechanism, a laminating mechanism and a locating mechanism; the material supplying and receiving mechanism comprises a first automatic clip material supplying machine, a first material receiving machine, a second automatic clip material supplying machine and a second material receiving machine; the transporting mechanism comprises a first transporting track and a second transporting track; the adhesive dispensing mechanism comprises a first silver colloid dispensing manipulator and a second silver colloid dispensing manipulator; the laminating mechanism comprises a base, a sliding rail, a four-axis laminating manipulator and a vacuum suction plate component; and the locating mechanism uses a CCD locating system. The adhesive dispensing and laminating machine for the fingerprint recognition component is mainly applied to adhesive dispensing and laminating processes of a fingerprint recognition cover plate and a metal ring to reach the requirements on laminating position and thickness accuracy, the operations of dispensing the adhesive and laminating are integrated, the automatic accurate adhesive dispensing and the high accuracy laminating are realized, the degree of automation and the controllability are strong, and the market prospect is wide.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification components manufacturing, in particular to a fingerprint identification component dispensing and laminating machine. Background technique [0002] At present, the application of fingerprint identification technology is the most extensive in biometric identification technology. The general direction of fingerprint identification application in the future embodies the huge potential of the market. At present, it is mainly divided into four categories: one is secret-related systems, which require high security protection; the other is The identification technology for large-scale crowds; the third is the citizen application for urban public affairs; the fourth is the authentication application that enters the virtual world of the Internet from real life. [0003] Judging from the trend, civilian fingerprint recognition technology will eventually replace identity codes and passwords...

AI Technical Summary

Problems solved by technology

[0010] Among them, manual dispensing and manual bonding is the most widely used production mode at present. The disadvantage is that it requires a lot of labor, and the product consistency is not good, and the scrap rate is high;

[0011] Automatic equipment controls dispensing and then manual lamination is a semi-automatic mode. The manual lamination method is mainly to manually place the upper substrate on the lower substrate that has been glued, and manually align the position, mainly relying on the self-weight of the upper substrate to provide lamination pressure. , it needs to be placed for a long time to ensure uniform bonding, and the production efficiency is very low

[0012] The semi-automatic lamination of the dispensing machine for dispensing and then laminating machine lamination, because the product needs to be manually transferred to the semi-automatic laminating equipment after the dispensing of the product, so the production process still requires a lot of labor, and the transfer process of the product or workpiece Requires great care and is less productive

Therefore, the existing production process has the following defects: the prior art uses a dispensing machine to carry out dispensing operations on each chip separately, usually after dispensing one chip and dispensing another chip, the work efficiency is low; the prior art cannot Realize the automatic operation of dispensing and bonding, manual bonding of the cover will reduce production efficiency; the existing technology cannot accurately position the chip and the cover, and the precision of the dispensing and bonding operation is low; the existing technology cannot realize automatic processing Material and automatic discharge, further reducing work efficiency, but also increasing labor costs

Images