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A kind of snagsbni lead-free solder alloy and its preparation method and application

A lead-free solder and alloy technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of high melting point and achieve the effect of good comprehensive performance, uniform composition and high spreadability

Active Publication Date: 2020-05-05
NANJING DAMAI SCI&TECH IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The high melting point lead-free solder currently developed and applied has performance issues related to the process: the melting point should be high, the solder joints in the early stage can not be damaged after the encapsulation process at 240 °C, the wettability is good, and it is non-toxic to the human body, etc.

Method used

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  • A kind of snagsbni lead-free solder alloy and its preparation method and application
  • A kind of snagsbni lead-free solder alloy and its preparation method and application
  • A kind of snagsbni lead-free solder alloy and its preparation method and application

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Comparison scheme
Effect test

Embodiment 1

[0037] A SnAgSbNi lead-free solder alloy, by weight percentage, contains Ag 3.0%, Sb 10.0%, Ni 0.03%, P 0.02%, and the balance is Sn. The metal purity and state used in this embodiment are described in the following table:

[0038] Metal Purity and Condition

[0039] Metal Purity (wt%) state Ag ≥99.95％ Ingot Sb ≥99.9％ Ingot sn ≥99.99％ Ingot Ni ≥99.99％ Ingot

[0040] The preparation method of described SnAgSbNi series lead-free solder alloy, comprises the following steps:

[0041] Step 1, master alloy preparation

[0042] Melting is carried out in a vacuum medium-frequency induction melting furnace. The graphite crucible is used for melting. The raw materials are calculated according to the proportion and put into the graphite crucible. P, Ge, Ga and other active elements are added to the secondary hopper (because they are relatively active and easy to oxidize and burn. , affect its yield, so before adding P, Ge, and Ga in th...

Embodiment 2

[0054] A SnAgSbNi lead-free solder alloy contains Ag 2.0%, Sb 8.0%, Ni 0.01%, P 0.02%, Be 0.01%, and the balance is Sn. The metal purity and state used in this embodiment are described in the following table:

[0055] Metal Purity and Condition

[0056] Metal Purity (wt%) state Ag ≥99.95％ Ingot Sb ≥99.9％ Ingot sn ≥99.99％ Ingot Ni ≥99.99％ Ingot

[0057] The preparation method of described SnAgSbNi series lead-free solder alloy, comprises the following steps:

[0058] Step 1, master alloy preparation

[0059] Melting is carried out in a vacuum medium-frequency induction melting furnace. The graphite crucible is used for melting. The raw materials are calculated according to the proportion and put into the graphite crucible. P, Ge, Ga and other active elements are added to the secondary hopper (because they are relatively active and easy to oxidize and burn. , affect its yield, so before adding P, Ge, and Ga in the molten pool,...

Embodiment 3

[0071] A SnAgSbNi lead-free solder alloy, by weight percentage, contains Ag 4.0%, Sb 12.0%, Ni 0.03%, P 0.02%, Be 0.01%, Ge 0.01%, Ga 0.01%, and the balance is Sn. The metal purity and state used in this embodiment are described in the following table:

[0072] Metal Purity and Condition

[0073] Metal Purity (wt%) state Ag ≥99.95％ Ingot Sb ≥99.9％ Ingot sn ≥99.99％ Ingot Ni ≥99.99％ Ingot

[0074] The preparation method of described SnAgSbNi series lead-free solder alloy, comprises the following steps:

[0075] Step 1, master alloy preparation

[0076] Melting is carried out in a vacuum medium-frequency induction melting furnace. The graphite crucible is used for melting. The raw materials are calculated according to the proportion and put into the graphite crucible. P, Ge, Ga and other active elements are added to the secondary hopper (because they are relatively active and easy to oxidize and burn. , affect its yield, so bef...

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Abstract

The invention discloses a SnAgSbNi-based lead-free solder alloy as well as a preparation method and an application thereof. The SnAgSbNi-based lead-free solder alloy comprises components in percentage by weight as follows: 2.0%-4.0% of Ag, 8.0%-12.0% of Sb, 0.01%-0.1% of Ni, at least one of microelements including P, Be, Ge, Ga, In, La and Ce and the balance of Sn, wherein the total quantity of the microelements is smaller than 1%. The SnAgSbNi-based lead-free solder alloy as well as the preparation method and the application thereof has the advantages as follows: (1), the melting point of the SnAgSbNi-based lead-free solder alloy is in a range of 235-250 DEG C, wettability and spreadability are higher, and comprehensive properties such as tensile strength, creep resistance and fatigue resistance and the like of a welding spot are better; (2), corrosion of tin solder to a silver layer on the surface of an electronic component in a use process can be effectively reduced, a previous welding spot is not molten during reflow soldering packaging at the temperature of about 250 DEG C, and product qualification rate is increased; (3), the lead content of the SnAgSbNi-based lead-free solder alloy can be controlled to be 100 ppm or lower, and the SnAgSbNi-based lead-free solder alloy is environment-friendly; (4), according to the method, alloying is easy to realize, the components are uniform, and the phenomenon of segregation is avoided.

Description

technical field [0001] The invention belongs to the field of electronic material alloys, and relates to welding and packaging technology of electronic components, in particular to a SnAgSbNi lead-free solder alloy with low silver solubility and high melting point, a preparation method and application thereof. Background technique [0002] At present, the global solder industry is facing severe technical challenges. After several years of development, the lead-free technology of electronic products has become more and more mature. The requirements for electronic components such as varistors and thermistors are also getting higher and higher. The process temperature is above 240°C, which requires the melting point of the tin solder used is higher than 240°C. If the melting point of the tin solder used is low, it will cause damage to the solder joints that have been soldered in the early stage when the encapsulation process is performed in the later stage. Due to the tin The me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40H05K3/34
CPCB23K35/262B23K35/40H05K3/3489
Inventor 满金亮吴宇宁徐海斌王小叶吴弼富
Owner NANJING DAMAI SCI&TECH IND CO LTD