Formula of anti-glare glue for LED packaging and manufacturing method

A technology of LED packaging and manufacturing method, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problems of backward production process, packaging failure, small internal stress, etc., and achieve good light consistency and soft light. Effect

Inactive Publication Date: 2017-06-13
深圳新光台电子科技有限公司
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Problems solved by technology

[0002] LED light sources have long service life, high luminous efficiency, no radiation and low power consumption. They are widely used in various display screens, car lights, backlights and lighting of various electronic products. The choice of packaging materials has an impact on the performance of LEDs. It is very important; the packaging materials currently used include highly transparent materials such as po

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  • Formula of anti-glare glue for LED packaging and manufacturing method

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[0022] The present invention will be further described below in conjunction with specific embodiments. The exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not as a limitation to the present invention.

[0023] In order to achieve the above object, the present invention provides an anti-glare LED encapsulation glue formula, comprising A component and B component;

[0024] The ratio of parts by weight of component A includes 100 parts of alicyclic epoxy resin, 0.01-5 parts of antioxidant, 0.01-5 parts of accelerator A, 1-200 parts of matte powder and 0.01-5 parts of defoamer share;

[0025] The ratio of parts by weight of the B component includes 60-150 parts of acid anhydride, 0.01-5 parts of antioxidant, 0.01-5 parts of accelerator B and 0.01-5 parts of defoamer;

[0026] The molar ratio of the epoxy group in component A to the anhydride in component B is 100:40-100:160.

[0027] Compared with the prior art, the ...

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Abstract

The invention discloses a formula of anti-glare glue for LED packaging and a manufacturing method of the glue. The formula comprises a component A and a component B, wherein the component A is prepared by mixing 100 parts of cycloaliphatic epoxy resin, 0.01-5 parts of antioxidant, 0.01-5 parts of an accelerant, 1-200 parts of matt powder and 0.01-5 parts of a defoaming agent uniformly; the component B is prepared by mixing 60-150 parts of acid anhydride, 0.01-5 parts of an antioxidant, 0.01-5 parts of an accelerant and 0.01-5 parts of a defoaming agent uniformly; the component A and the component B are mixed uniformly in the mole ratio of epoxy groups in the component A to acid anhydride in the component B being (100:40)-(100:160), and the required epoxy resin packaging glue is obtained. The glue can convert traditional point light emitting of a point light source into surface light emitting after being applied to LEDs and is also anti-glare.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation glue and a manufacturing method thereof, in particular to an anti-glare LED encapsulating glue formula and a manufacturing method thereof. Background technique [0002] LED light sources have long service life, high luminous efficiency, no radiation and low power consumption. They are widely used in various display screens, car lights, backlights and lighting of various electronic products. The choice of packaging materials has an impact on the performance of LEDs. It is very important; the packaging materials currently used include highly transparent materials such as polymethyl methacrylate, glass, and silicone. Silicone materials have small internal stress, good high and low temperature resistance, and no yellowing, but there is adhesion to the substrate Poor performance, leading to package failure, or decline in aging resistance performance, and due to backward production technology,...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06H01L33/56
CPCC09J163/00C08L2201/08C08L2203/206C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J11/06H01L33/56C08L63/00C08K13/02C08K3/36
Inventor 雷均勇谭伟东刘伟东梁少芬张大梅文群马甲强曾露露
Owner 深圳新光台电子科技有限公司
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