Formula of anti-glare glue for LED packaging and manufacturing method

Abstract

The invention discloses a formula of anti-glare glue for LED packaging and a manufacturing method of the glue. The formula comprises a component A and a component B, wherein the component A is prepared by mixing 100 parts of cycloaliphatic epoxy resin, 0.01-5 parts of antioxidant, 0.01-5 parts of an accelerant, 1-200 parts of matt powder and 0.01-5 parts of a defoaming agent uniformly; the component B is prepared by mixing 60-150 parts of acid anhydride, 0.01-5 parts of an antioxidant, 0.01-5 parts of an accelerant and 0.01-5 parts of a defoaming agent uniformly; the component A and the component B are mixed uniformly in the mole ratio of epoxy groups in the component A to acid anhydride in the component B being (100:40)-(100:160), and the required epoxy resin packaging glue is obtained. The glue can convert traditional point light emitting of a point light source into surface light emitting after being applied to LEDs and is also anti-glare.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation glue and a manufacturing method thereof, in particular to an anti-glare LED encapsulating glue formula and a manufacturing method thereof. Background technique [0002] LED light sources have long service life, high luminous efficiency, no radiation and low power consumption. They are widely used in various display screens, car lights, backlights and lighting of various electronic products. The choice of packaging materials has an impact on the performance of LEDs. It is very important; the packaging materials currently used include highly transparent materials such as polymethyl methacrylate, glass, and silicone. Silicone materials have small internal stress, good high and low temperature resistance, and no yellowing, but there is adhesion to the substrate Poor performance, leading to package failure, or decline in aging resistance performance, and due to backward production technology,...

AI Technical Summary

Problems solved by technology

[0002] LED light sources have long service life, high luminous efficiency, no radiation and low power consumption. They are widely used in various display screens, car lights, backlights and lighting of various electronic products. The choice of packaging materials has an impact on the performance of LEDs. It is very important; the packaging materials currently used include highly transparent materials such as polymethyl methacrylate, glass, and silicone. Silicone materials have small internal stress, good high and low temperature resistance, and no yellowing, but there is adhesion to the substrate Poor performance, leading to package failure, or decline in aging resistance performance, and due to backward production technology, LED sealing performance after packaging is not stable, resulting in short service life of LED

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