Simple and novel structure for testing thin film thermal properties

Abstract

The invention relates to the technical field of testing of material thermal properties, and particularly relates to a simple and novel structure for testing thin film thermal properties. The structure comprises a plurality of same series-connection cantilever beams arranged on a substrate, and the cantilever beams are each formed by completely overlapping a to-be-measured thin film and a temperature testing heating resistance thin film having the same plane figure from bottom to top. The relatively ideal signal-to-noise ratio is obtained due to large useful signals, and the requirements on a subsequent signal processing circuit can be effectively reduced; the structure is reliable, the risk of failure because the cantilever beams make contact with the substrate due to too long cantilever beams is avoided, the difficulty of the process can be greatly reduced, and the success rate of production is improved; the preparation process is simple, and one-time molding is achieved; a result is accurate, a thermal parameter expression is simple, and a testing method is relatively simple.

Description

technical field [0001] The invention relates to the technical field of thermal performance testing of materials, in particular to a simple and novel thin film thermal performance testing structure and a preparation method thereof. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS), the size of devices is becoming smaller and smaller. At the micro / nano scale, the thermal properties of thin films are becoming more and more important. The thermal properties directly determine the stability of MEMS devices. sex. However, under the influence of the size effect, the thermal properties of the film and its bulk material show great differences, and the classical test theory can no longer be adapted to the test of the thermal properties of the film. In the past, the test structures for the thermal properties of materials were often complex and difficult to manufacture, with low success rates. Therefore, it is necessary to propose a sim...

AI Technical Summary

Problems solved by technology

[0003] However, in most of the thermal parameter tests of thin films in the past, the test structure used a two-dimensional or even three-dimensional heat conduction test structure. On the one hand, this makes the expression of the temperature rise of the test structure obtained by derivation more complicated, which is not conducive to extracting the parameters to be measured. On the one hand, it makes the structural processing difficult; for this reason, we proposed a one-dimensional cantilever beam thermal parameter testing structure in our previous work

However, the structure is still relatively complicated, and multiple photolithography is required; in addition, to obtain a sufficiently high signal, it is necessary to process a cantilever beam with a large aspect ratio. According to ANSYS simulation, when the aspect ratio is greater than 9, the stress inside the cantilever beam will be can become unpredictable, with a high probability of bending when the sacrificial layer is released causing the cantilever to contact the substrate

These problems will undoubtedly greatly increase the probability of experimental failure

Images