A fully automatic testing machine for semiconductor chips

Abstract

The invention relates to a full automatic detection machine for semiconductor chips. The full automatic detection machine comprises a rack, a distribution control box and an operation display screen, the rack is provided with a middle rotary table detection device and a side rotary table detection device, the middle rotary table detection device comprises a middle rotating shaft, a middle detection rotary table and a middle installation rotary table are connected to the middle rotating shaft in a sleeving mode, the middle detection rotary table is provided with detection holes, reclaiming devices penetrating out of the detection holes are installed on the middle installation rotary table, the side rotary table detection device comprises a side rotating shaft connected with a side rotating motor, a side rotary table is connected to the side rotating shaft in a sleeving mode, carriers matched with the semiconductor chips are arranged on the side rotary plate, the side rotary table is located on the lower portion of the middle rotary table, one carrier on the side rotary table is connected with one reclaiming device penetrating through the middle rotary table in an abutted mode. Accordingly, by means of mutual cooperation of the middle rotary detection device and the side rotary detection device, integration of multiple detection processes of the semiconductor chips is achieved, the detection efficiency is greatly improved, and the detection working hours are reduced.

Description

technical field [0001] The invention relates to the field of processing equipment for electronic components, in particular to a fully automatic testing machine for semiconductor chips. Background technique [0002] With the rapid development of electronic engineering, various electronic components are used more and more widely. Chips are commonly used electronic components, among which semiconductor chips are the most widely used. [0003] During the processing of semiconductor chips, it is necessary to inspect the processed chips. There are many inspection items, including photoelectric inspection (photoelectric conversion efficiency of the product), resistance inspection, and resistivity inspection (multiple inspections are required to calculate the average value), Visual inspection (appearance inspection by CCD camera) and conductive inspection under various conditions (such as high temperature, radiation, strong light, etc.), while most of the existing semiconductor chip...

AI Technical Summary

Problems solved by technology

[0003] During the processing of semiconductor chips, it is necessary to inspect the processed chips. There are many inspection items, including photoelectric inspection (photoelectric conversion efficiency of the product), resistance inspection, and resistivity inspection (multiple inspections are required to calculate the average value), Visual inspection (appearance inspection by CCD camera) and conductive inspection under various conditions (such as high temperature, radiation, strong light, etc.), while most of the existing semiconductor chip inspections use multiple equipment for sub-process inspection, among which resistivity The detection is to perform multiple detections on one device to calculate the average value, and the overall detection efficiency is low and time-consuming

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