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Method for producing printed circuit board by using calixarene

A printed circuit board and calixarene technology, which is applied in the processing field of printed circuit boards, can solve the problems of low adhesion of copper particles, decreased processing efficiency of printed circuit boards, etc., so as to eliminate the steric hindrance effect and avoid impedance increase. , reduce the effect of oxidation reaction

Active Publication Date: 2017-06-13
GUANGDONG CHENGDE ELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional patching method also has the problem of low adhesion of copper particles on the substrate at the patching point, and the patching operation needs to be performed separately, resulting in a significant drop in the processing efficiency of printed circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The method for making printed circuit board of the present invention comprises the steps:

[0048] (1) Preparation of printing solution

[0049] a) under normal temperature and pressure, respectively add calixarene and organic solvent into a container with a stirring device, and continue stirring for 5 minutes to obtain a calixarene solution, and the mass percentage of calixarene in the solution is 1%;

[0050] b) Under normal temperature and pressure, add the liquid copper slurry and the calixarene solution obtained in step a into a container with a dispersing device, and continue to disperse for 10 minutes at a speed of 400 rpm, and then discharge the material to obtain a printing solution. The mass ratio of copper particles to calixarene in the primary printing solution is 2:1;

[0051] (2) Substrate pretreatment

[0052] c) Drill and clean the substrate according to the circuit requirements, and place the substrate on the screen printing table of the screen printi...

Embodiment 2

[0061] The method for making printed circuit board of the present invention comprises the steps:

[0062] (1) Preparation of printing solution

[0063] a) under normal temperature and pressure, respectively add calixarene and organic solvent into a container with a stirring device, and continue stirring for 30 minutes to obtain a calixarene solution, and the mass percentage of calixarene in the solution is 20%;

[0064] b) Under normal temperature and pressure, add the liquid copper slurry and the calixarene solution obtained in step a into a container with a dispersing device, and continue to disperse for 40 minutes at a speed of 900 rpm, and then discharge the material to obtain a printing solution. The mass ratio of copper particles to calixarene in the primary printing solution is 8:1;

[0065] (2) Substrate pretreatment

[0066] c) Drill and clean the substrate according to the circuit requirements, and place the substrate on the screen printing table of the screen prin...

Embodiment 3

[0075] The method for making printed circuit board of the present invention comprises the steps:

[0076] (1) Preparation of printing solution

[0077]a) under normal temperature and pressure, respectively add calixarene and organic solvent into a container with a stirring device, and continue stirring for 15 minutes to obtain a calixarene solution, and the mass percentage of calixarene in the solution is 6%;

[0078] b) Under normal temperature and pressure, add the liquid copper slurry and the calixarene solution obtained in step a into a container with a dispersing device, and continue to disperse for 15 minutes at a speed of 500 rpm, and then discharge the material to obtain a printing solution. The mass ratio of copper particles to calixarene in the primary printing solution is 3:1;

[0079] (2) Substrate pretreatment

[0080] c) Drill and clean the substrate according to the circuit requirements, and place the substrate on the screen printing table of the screen printi...

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PUM

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Abstract

The invention discloses a method for producing a printed circuit board by using calixarene. The method comprises the following steps of: a) adding the calixarene and an organic solvent into a container with a stirring device separately at normal pressure and temperature, and stirring the calixarene and the organic solvent continuously so as to obtain a calixarene solution; b) adding liquid copper slurry and the calixarene solution to a container with a dispersion device separately at normal pressure and temperature, performing dispersion continuously, filtering out the material so as to obtain a primary printing liquid; c) drilling and cleaning a substrate, and placing the substrate on a screen printing machine; d) applying the obtained primary printing liquid to the screen printing machine and applying the primary printing liquid to the substrate to form a printing liquid layer; and e) baking the obtained substrate in a baking oven and then naturally cooling the substrate so as to obtain the printed circuit board. The method for producing the printed circuit board by using calixarene is friendly to environment, can improve the adhesive force of copper particles on the substrate, and reduces the impedance of a conductive line.

Description

technical field [0001] The invention relates to the field of processing printed circuit boards, in particular to a method for manufacturing printed circuit boards using calixarene, which has good environmental performance and excellent quality stability. Background technique [0002] With the continuous development of the economy, printed circuit boards are increasingly widely used in household appliances, industrial electronics and other industries. Because the printed circuit board has the advantages of greatly reducing the processing cost of electronic products, strong industrial reproducibility, high degree of automation and high production efficiency, it is favored by the majority of electrical and electronic industry manufacturers. However, there are two major technical deficiencies in the existing printed circuit board production process. First, traditional printed circuit boards are usually processed by a reduction method, which is mainly composed of cleaning, lamin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12
CPCH05K3/1233H05K3/1283H05K2203/1476
Inventor 吴子坚刘镇权陈世荣程静邬通芳
Owner GUANGDONG CHENGDE ELECTRONICS TECH CO LTD
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