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37results about How to "Low chemical reactivity" patented technology

Near single-crystalline, high-carrier-mobility silicon thin film on a polycrystalline/amorphous substrate

A template article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800° C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material; is provided, together with a semiconductor article including a base substrate including: (i) a base material selected from the group consisting of polycrystalline substrates and amorphous substrates, and (ii) at least one layer of a differing material upon the surface of the base material; and, a buffer material layer upon the base substrate, the buffer material layer characterized by: (a) low chemical reactivity with the base substrate, (b) stability at temperatures up to at least about 800° C. under low vacuum conditions, and (c) a lattice crystal structure adapted for subsequent deposition of a semiconductor material, and, a top-layer of semiconductor material upon the buffer material layer.
Owner:LOS ALAMOS NATIONAL SECURITY

Release surfaces, particularly for use in nanoimprint lithography

The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula:
RELEASE-M(X)n-1
RELEASE-M(X)n-m-1Qm,
Or
RELEASE-M(OR)n-1—, wherein
    • RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties;
    • M is a metal atom, semiconductor atom, or semimetal atom;
    • X is a halogen or cyano, especially Cl, F, or Br;
    • Q is hydrogen or alkyl group;
    • M is the number Q represents
    • R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and
    • N is the valence −1 of M,
    • and n-m-1 is at least 1
provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patters in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent process, reproduced in the substrate or in another material which is added onto the substrate.
Owner:CHOU

Lithographic method for molding a pattern

The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n-1—RELEASE-M(X)n-m-1Qm, or RELEASE-M(OR)n-1—, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is halogen or cyano, especially Cl, F, or Br; Q is hydrogen or alkyl group; m is the number of Q groups; R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and; n is the valence −1 of M, and n−m−1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.
Owner:CHOU

Release surfaces, particularly for use in nanoimprint lithography

The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula:RELEASE-M(X)n−1-RELEASE-M(X)n−m−1 Qm,OrRELEASE-M(OR)n−1-,whereinRELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties;M is a metal atom, semiconductor atom, or semimetal atom;X is a halogen or cyano, especially Cl, F, or Br;Q is hydrogen or alkyl group;M is the number Q representsR is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; andN is the valence −1 of M,and n−m−1 is at least 1provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patters in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent process, reproduced in the substrate or in another material which is added onto the substrate.
Owner:RGT UNIV OF MINNESOTA

Nano-diamond modified liquid band aid and preparation method thereof

A nano-diamond modified liquid band aid is prepared from raw materials in parts by weight as follows: 15-20 parts of a film forming material, 10-20 parts of ethyl acetate, 40-50 parts of ethanol, 3-5parts of propylene glycol, 2-6 parts of polydimethylsiloxane, 4-7 parts of medical vaseline, 4-8 parts of a cattail spike extract and 2-4 parts of modified nano-diamond, wherein the film forming material, ethyl acetate, ethanol, propylene glycol, polydimethylsiloxane and the medical vaseline are taken as basic raw materials, the cattail spike extract and the modified nano-diamond are taken as active ingredients, and the sum of parts of the basic raw materials and the cattail spike extract by weight is 100. The invention further discloses a preparation method of the nano-diamond modified liquidband aid. Compared with conventional band aids, the liquid band aid is convenient to use, has good antibacterial and anti-inflammatory functions and has no irritation or toxicity to skin, external wounds in any shape and in any position can be more conveniently treated, and the liquid band aid can rapidly form a film and has the efficacy of stopping bleeding, diminishing inflammation, relieving pain and promoting blood circulation to remove blood stasis.
Owner:THE FIRST AFFILIATED HOSPITAL OF ZHENGZHOU UNIV

Method for processing printed circuit board by applying calixarene

The invention discloses a method for processing a printed circuit board by applying calixarene. The method comprises the following steps that a) calixarene and an organic solvent are added to a container equipped with a stirring device under the normal temperature and the normal pressure and continuously stirred so as to obtain a calixarene solution; b) liquid silver paste and the calixarene soluation are added to a container equipped with a dispersing device under the normal temperature and the normal pressure and continuously dispersed and then discharged so as to obtain primary printing liquid; c) drilling and cleaning and other processing are performed on a substrate according to the line requirements and the substrate is arranged on a screen printing machine; d) printing liquid is added to the screen printing machine, and the primary printing liquid is coated on the substrate; and e) the substrate is arranged in a baking oven to be baked and then naturally cooled to the normal temperature and then the printed circuit board manufactured by applying calixarene can be obtained. The method for processing the printed circuit board by applying calixarene is high in environmental protection performance and can enhance the adhesive force of silver particles on the substrate so as to effectively reduce the processing cost of the printed circuit board.
Owner:GUANGDONG CHENGDE ELECTRONICS TECH CO LTD +1

A method of applying calixarene to process printed circuit boards

The invention discloses a method for processing a printed circuit board by applying calixarene. The method comprises the following steps that a) calixarene and an organic solvent are added to a container equipped with a stirring device under the normal temperature and the normal pressure and continuously stirred so as to obtain a calixarene solution; b) liquid silver paste and the calixarene soluation are added to a container equipped with a dispersing device under the normal temperature and the normal pressure and continuously dispersed and then discharged so as to obtain primary printing liquid; c) drilling and cleaning and other processing are performed on a substrate according to the line requirements and the substrate is arranged on a screen printing machine; d) printing liquid is added to the screen printing machine, and the primary printing liquid is coated on the substrate; and e) the substrate is arranged in a baking oven to be baked and then naturally cooled to the normal temperature and then the printed circuit board manufactured by applying calixarene can be obtained. The method for processing the printed circuit board by applying calixarene is high in environmental protection performance and can enhance the adhesive force of silver particles on the substrate so as to effectively reduce the processing cost of the printed circuit board.
Owner:GUANGDONG CHENGDE ELECTRONICS TECH CO LTD +1

A kind of method utilizing calixarene to process printed circuit board

The invention discloses a method for processing a printed circuit board by using calixarene. The method comprises the following steps of (a) adding the calixarene and an organic solvent to a container with a stirring device at a room temperature and atmospheric pressure and lastingly stirring to obtain a printing liquid; (b) carrying out treatment of drilling, cleaning and the like on a substrate and putting the substrate on one screen printing machine; (c) adding the printing liquid to the screen printing machine and rubbing the substrate with the printing liquid; (d) putting the substrate in the environments of the room temperature and the atmospheric pressure, naturally airing for later use and forming a printing liquid layer by the printing liquid on the substrate; (e) putting the substrate on a screen printing table of another screen printing machine, adding liquid silver paste to the screen printing machine and rubbing the printing liquid layer with the silver paste; and (f) putting the substrate obtained in the step (e) into an oven for baking, and naturally cooling to obtain the printed circuit board. The method for processing the printed circuit board by using the calixarene is high in environmental protection property, the adhesive force of silver particles on the substrate can be improved and the impedance of a conducting circuit can be reduced.
Owner:GUANGDONG CHENGDE ELECTRONICS TECH CO LTD +1
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