Method for processing printed circuit board by applying calixarene

Abstract

The invention discloses a method for processing a printed circuit board by applying calixarene. The method comprises the following steps that a) calixarene and an organic solvent are added to a container equipped with a stirring device under the normal temperature and the normal pressure and continuously stirred so as to obtain a calixarene solution; b) liquid silver paste and the calixarene soluation are added to a container equipped with a dispersing device under the normal temperature and the normal pressure and continuously dispersed and then discharged so as to obtain primary printing liquid; c) drilling and cleaning and other processing are performed on a substrate according to the line requirements and the substrate is arranged on a screen printing machine; d) printing liquid is added to the screen printing machine, and the primary printing liquid is coated on the substrate; and e) the substrate is arranged in a baking oven to be baked and then naturally cooled to the normal temperature and then the printed circuit board manufactured by applying calixarene can be obtained. The method for processing the printed circuit board by applying calixarene is high in environmental protection performance and can enhance the adhesive force of silver particles on the substrate so as to effectively reduce the processing cost of the printed circuit board.

Description

technical field [0001] The invention relates to the field of processing printed circuit boards, in particular to a method for processing printed circuit boards with calixarene, which has good environmental performance and excellent quality stability. Background technique [0002] With the continuous development of the economy, printed circuit boards are increasingly widely used in household appliances, industrial electronics and other industries. Because the printed circuit board has the advantages of greatly reducing the processing cost of electronic products, strong industrial reproducibility, high degree of automation and high production efficiency, it is favored by the majority of electrical and electronic industry manufacturers. However, there are two major technical deficiencies in the existing printed circuit board production process. First, traditional printed circuit boards are usually processed by a reduction method, which is mainly composed of cleaning, laminatio...

AI Technical Summary

Problems solved by technology

However, due to the waste of a large amount of metal materials caused by the traditional reduction method and silk screen method, and silver is a precious metal, it has not been widely used in the processing of printed circuit boards.