A kind of method utilizing calixarene to process printed circuit board

A technology for printed circuit boards and calixarene, which is applied in the processing field of printed circuit boards, can solve the problems of not being widely used, waste of metal materials, etc., and achieve the effects of eliminating steric hindrance, improving utilization, and avoiding falling off.

Active Publication Date: 2019-06-25
GUANGDONG CHENGDE ELECTRONICS TECH CO LTD +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the waste of a large amount of metal materials caused by the traditional reduction method and silk screen method, and silver is a precious metal, it has not been widely used in the processing of printed circuit boards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] The method for making printed circuit board of the present invention comprises the steps:

[0050] (1) Preparation of printing solution

[0051] a) under normal temperature and pressure, respectively add calixarene and organic solvent into a container with a stirring device, and continue stirring for 10 minutes to obtain a printing solution, the mass percentage of calixarene in the printing solution is 2%;

[0052] (2) Substrate pretreatment

[0053] b) Drill and clean the substrate according to the circuit requirements, and place the substrate on the screen printing table of the screen printing machine;

[0054] c) Add the printing liquid obtained in step a to the screen printing machine in step b, and wipe the printing liquid onto the substrate according to the circuit requirements;

[0055] d) placing the substrate obtained in step c in an environment of normal temperature and pressure, and wait for it to dry naturally for later use, and the printing liquid forms a...

Embodiment 2

[0064] The method for making printed circuit board of the present invention comprises the steps:

[0065] (1) Preparation of printing solution

[0066] a) under normal temperature and pressure, add calixarene and organic solvent respectively into a container with a stirring device, and continue stirring for 30 minutes to obtain a printing solution, the mass percentage of calixarene in the printing solution is 20%;

[0067] (2) Substrate pretreatment

[0068] b) Drill and clean the substrate according to the circuit requirements, and place the substrate on the screen printing table of the screen printing machine;

[0069] c) Add the printing liquid obtained in step a to the screen printing machine in step b, and wipe the printing liquid onto the substrate according to the circuit requirements;

[0070] d) placing the substrate obtained in step c in an environment of normal temperature and pressure, and wait for it to dry naturally for later use, and the printing liquid forms ...

Embodiment 3

[0079] The method for making printed circuit board of the present invention comprises the steps:

[0080] (1) Preparation of printing solution

[0081] a) under normal temperature and pressure, respectively add calixarene and organic solvent into a container with a stirring device, and continue stirring for 15 minutes to obtain a printing solution, the mass percentage of calixarene in the printing solution is 8%;

[0082] (2) Substrate pretreatment

[0083] b) Drill and clean the substrate according to the circuit requirements, and place the substrate on the screen printing table of the screen printing machine;

[0084] c) Add the printing liquid obtained in step a to the screen printing machine in step b, and wipe the printing liquid onto the substrate according to the circuit requirements;

[0085]d) placing the substrate obtained in step c in an environment of normal temperature and pressure, and wait for it to dry naturally for later use, and the printing liquid forms a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for processing a printed circuit board by using calixarene. The method comprises the following steps of (a) adding the calixarene and an organic solvent to a container with a stirring device at a room temperature and atmospheric pressure and lastingly stirring to obtain a printing liquid; (b) carrying out treatment of drilling, cleaning and the like on a substrate and putting the substrate on one screen printing machine; (c) adding the printing liquid to the screen printing machine and rubbing the substrate with the printing liquid; (d) putting the substrate in the environments of the room temperature and the atmospheric pressure, naturally airing for later use and forming a printing liquid layer by the printing liquid on the substrate; (e) putting the substrate on a screen printing table of another screen printing machine, adding liquid silver paste to the screen printing machine and rubbing the printing liquid layer with the silver paste; and (f) putting the substrate obtained in the step (e) into an oven for baking, and naturally cooling to obtain the printed circuit board. The method for processing the printed circuit board by using the calixarene is high in environmental protection property, the adhesive force of silver particles on the substrate can be improved and the impedance of a conducting circuit can be reduced.

Description

technical field [0001] The invention relates to the field of processing printed circuit boards, in particular to a method for processing printed circuit boards with calixarene, which has both good environmental performance and excellent quality stability. Background technique [0002] With the continuous development of the economy, printed circuit boards are increasingly widely used in household appliances, industrial electronics and other industries. Because the printed circuit board has the advantages of greatly reducing the processing cost of electronic products, strong industrial reproducibility, high degree of automation and high production efficiency, it is favored by the majority of electrical and electronic industry manufacturers. However, there are two major technical deficiencies in the existing printed circuit board production process. First, traditional printed circuit boards are usually processed by a reduction method, which is mainly composed of cleaning, lami...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12
CPCH05K3/1216H05K3/1283H05K2203/0502
Inventor 刘镇权陈世荣吴子坚程静
Owner GUANGDONG CHENGDE ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products