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High resolution detection and recognition method for debonding defect of composite material

A composite material and high-resolution technology, applied in character and pattern recognition, instruments, computer components, etc., can solve problems such as edge blur, noise interference, and low resolution, and achieve improved contrast, improved accuracy, and improved resolution Effect

Active Publication Date: 2017-06-23
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the image obtained by the optical excitation infrared thermal imaging system is affected by the thermal imager and the lateral thermal diffusion of the composite material, and has the disadvantages of low resolution, blurred edges, and noise interference. In order to improve the accuracy and efficiency of defect detection, many feature extraction Algorithms are used to extract image defect information, such as thermal imaging signal reconstruction (TSR), principal component analysis (PCA) and pulse phase thermal imaging (PPT), etc.

Method used

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  • High resolution detection and recognition method for debonding defect of composite material
  • High resolution detection and recognition method for debonding defect of composite material
  • High resolution detection and recognition method for debonding defect of composite material

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Embodiment

[0023] figure 1 It is a flowchart of a high-resolution detection and identification method for debonding defects of composite materials in the present invention.

[0024] In this example, if figure 1 As shown, a kind of high-resolution detection and identification method to composite material debonding defect of the present invention comprises the following steps:

[0025] S1, preprocessing

[0026] When the test piece is excited by the heat source, in the process of thermal equilibrium, part of the defect information can be displayed in the infrared thermal image, and the physical characteristics of the surface temperature field changing with time and space can be expressed by known mathematical models. When performing theoretical analysis, the temperature change of each pixel point can be simplified into a one-dimensional heat conduction model, and post-processing analysis is performed on this basis. The mathematical model of the surface temperature of the specimen can be ...

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Abstract

The present invention discloses a high resolution detection and recognition method for a debonding defect of a composite material. A sample with a defect is under the effect of an infrared thermal imaging system, the thermal diffusion and thermal radiation properties of a material are different at different areas of the material, the defect has a high temperature area, the surface temperature field collected by a thermal imager can reflect certain defect information with time and space transform, information is provided for a later feature extraction algorithm, and the information of the debonding defect of the composite material is extracted based on an integrated variational Bayesian tensor decomposition algorithm.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing and evaluation, and more specifically relates to a high-resolution detection and identification method for debonding defects of composite materials. Background technique [0002] Due to the advantages of high specific strength, large specific modulus, good fatigue resistance, low expansion coefficient and strong designability, carbon fiber reinforced composites (CFRP) have become indispensable and important structural materials in high-tech fields such as aerospace. However, damage is unavoidable in the process of manufacturing, assembly, long-term service, etc. Common internal defects of composite composite structures include delamination, debonding, inclusions, etc. Since the deformation of the internal structure is difficult to detect and causes great damage, With the continuous improvement of processing technology and application requirements of composite materials, higher requ...

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Application Information

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IPC IPC(8): G06K9/62
CPCG06F18/24155
Inventor 高斌冯琪智鲁鹏
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA