Packaging structure and display
A packaging structure and packaging cover technology, applied in the field of display screen, can solve problems such as insufficient mechanical strength and easy damage, and achieve the effects of ensuring process stability, improving compression resistance and light weight.
Active Publication Date: 2020-07-31
SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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Problems solved by technology
[0005] The purpose of the present invention is to provide a packaging structure to solve the problem that the existing packaging structure has insufficient mechanical strength and is easily damaged in a high-voltage environment
Method used
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Embodiment Construction
[0020] As mentioned in the background, in order to broaden the application fields of various electronic devices with packaging structures, it is necessary to further improve the mechanical strength of the packaging structures. However, the existing packaging structure is limited by its mechanical strength, which leads to the problem that it cannot be used in some high-voltage environments. figure 1 A packaging structure of a display panel is shown, and the display panel 11 and the packaging cover plate 12 are generally made of glass. in the right figure 1 During the destructive test of the package structure shown, when the pusher 20 acts on the package cover 12 with a force of about 100 N, the package cover 12 is damaged. That is, the maximum pressure that the packaging cover plate 12 can withstand is about 0.221Mpa, and the underwater pressure within the range of 10m-60m underwater is about 0.5Mpa-0.6Mpa. visible, figure 1 The packaging structure shown cannot meet the requ...
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Abstract
The invention provides a packaging structure and a packaging structure of a display screen, which include a base plate, a packaging cover plate, and a reinforcing cover plate. The package cover has a first surface and a second surface opposite to the first surface, the substrate is located on the first surface of the package cover, and the reinforcing cover covers the package cover the second surface of the board. That is, the reinforcing cover can effectively alleviate or even prevent external pressure from acting on the package cover, thereby reducing the probability of damage to the package cover and making the package structure have better damage resistance. Therefore, when the packaging structure is applied to an electronic device, the mechanical strength of the electronic device can be correspondingly improved, so that the electronic device can be used normally even in a high-voltage environment.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure and a display screen comprising the packaging structure. Background technique [0002] In the manufacturing process of the display, after the relevant processes of the display panel are completed, the display panel needs to be packaged to connect corresponding circuits and protect the display screen. Therefore, the packaging structure after packaging needs to ensure a certain degree of mechanical strength, so as to resist the damage of the packaging structure caused by external force, so as to ensure that the display screen can work normally; and have the ability to resist water vapor and oxidation, so as to prevent the display panel from being oxidized Or corrosion will affect its performance. [0003] figure 1 It is a schematic diagram of an existing packaging structure, such as figure 1 As shown, the existing package structure generally includes a dis...
Claims
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IPC IPC(8): H01L23/04H01L51/52
CPCH01L23/04H10K50/841
Inventor 穆欣炬浦斌张志峰
Owner SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD