PCB surface automatic film plating process

A PCB board, automatic technology, applied in the field of automatic coating process on the surface of PCB board, can solve problems such as insufficient, PCB color difference, film thickness, etc., to achieve the effect of uniform erosion, uniform thickness, and enhanced cleaning effect

Inactive Publication Date: 2017-07-07
SUZHOU WUTONG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide an automatic coating process on the surface of PCB to solve the problems of chromatic aberration and insufficient film thickness when coating PCB.

Method used

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  • PCB surface automatic film plating process

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Such as figure 1 An automatic coating process on the surface of a PCB board as shown, comprising the following steps:

[0021] 1) Board entry: Manually place the PCB board on the transfer roller of the entry station of the automatic anti-oxidation machine production line;

[0022] 2) Degreasing: The PCB board passes through the degreasing station evenly with the conveying roller, and the nozzle installed at the degreasing station sprays the degreasing agent to the surface of the PCB board;

[0023] 3) The first water washing: the PCB board prepared in step 2) is transported to the first water washing station through the transfer roller and cleaned with a water knife. The number of the first water washing stations is 3, and the pressure of the water knife is For: 2kg / cm 2 ;

[0024] 4) Micro-etching: The PCB board prepared in step 3) is transported to the micro-etching station by the transfer roller and immersed in the micro-etching tank for anti-oxidation treatment, ...

Embodiment 2

[0033] An automatic coating process on the surface of a PCB, comprising the following steps:

[0034] 1) Board entry: Manually place the PCB board on the transfer roller of the entry station of the automatic anti-oxidation machine production line;

[0035] 2) Degreasing: The PCB board passes through the degreasing station evenly with the conveying roller, and the nozzle installed at the degreasing station sprays the degreasing agent to the surface of the PCB board;

[0036] 3) The first water washing: the PCB board prepared in step 2) is transported to the first water washing station through the transfer roller and cleaned with a water knife. The number of the first water washing stations is 3, and the pressure of the water knife is For: 2.2kg / cm 2 ;

[0037] 4) Micro-etching: The PCB board prepared in step 3) is transported to the micro-etching station by the transfer roller and immersed in the micro-etching tank for anti-oxidation treatment, and the micro-etching solution ...

Embodiment 3

[0046] An automatic coating process on the surface of a PCB, comprising the following steps:

[0047] 1) Board entry: Manually place the PCB board on the transfer roller of the entry station of the automatic anti-oxidation machine production line;

[0048] 2) Degreasing: The PCB board passes through the degreasing station evenly with the conveying roller, and the nozzle installed at the degreasing station sprays the degreasing agent to the surface of the PCB board;

[0049]3) The first water washing: the PCB board prepared in step 2) is transported to the first water washing station through the transfer roller and cleaned with a water knife. The number of the first water washing stations is 3, and the pressure of the water knife is For: 2.1kg / cm 2 ;

[0050] 4) Micro-etching: The PCB board prepared in step 3) is transported to the micro-etching station by the transfer roller and immersed in the micro-etching tank for anti-oxidation treatment, and the micro-etching solution i...

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Abstract

The invention discloses a PCB surface automatic film plating process. A PCB is machined through 11 processes of board feeding-deoiling-primary water washing-micro etching-secondary water washing-antioxidation-ternary water washing-cold wind drying-hot wind drying-board discharge; two-section micro etching guarantees uniform engagement of large copper surface positions and no aberration; three-section water washing before antioxidation reinforces the cleaning effect, and prevents excessive taking of acid medicine water into an antioxidation tank; the OSP film surface thickness is uniform; and meanwhile, the automation degree is high, operators only manually place and collect boards, and the labor intensity is reduced.

Description

technical field [0001] The invention relates to a PCB coating process, in particular to an automatic coating process on the surface of a PCB. Background technique [0002] OSP is the abbreviation of Organic Solderability Preservatives, translated as organic solder protection film, also known as copper protection agent. To put it simply, OSP is to grow a layer of organic film on the clean bare copper surface by chemical method. This film has anti-oxidation, thermal shock resistance and moisture resistance, and is used to protect the copper surface from continuing in the normal environment. Rust (oxidation or vulcanization, etc.); but in the subsequent high temperature welding, this protective film must be easily removed quickly by the flux, so that the exposed clean copper surface can be combined with molten solder in a very short time Immediately bonds into a strong solder joint. In the existing process, when OSP treatment is performed on the PCB surface, due to incomplete...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F11/08C23F17/00
CPCC23F1/18C23F11/08C23F17/00
Inventor 张斯磊
Owner SUZHOU WUTONG ELECTRONICS CO LTD
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