Wiring structure, display substrate and display device

[0021] Example 1:

[0022] Combine Figure 1-4 As shown, this embodiment provides a wiring structure, which includes a plurality of hollow units 1 connected in series, and each hollow unit 1 includes a hollow area 11 and a non-hollow area 10; wherein, any two adjacent ones The hollow area 11 of the hollow unit 1 at least partially overlaps, and the non-hollow area 10 does not overlap.

[0023] It should be noted here that the positions where the hollow areas 11 of any two adjacent hollow units 1 at least partially overlap can be formed on the same layer during preparation, that is, the two hollow units 1 are in the same layer. Of course, the two hollow units 1 can also be arranged in two layers. In this case, it is necessary to provide an insulating layer between the layers where the two hollow units 1 are located during the preparation. A via is formed at the connection position so that the two can be electrically connected later.

[0024] Since the wiring structure in this embodiment is composed of a plurality of hollow units 1 connected in series, a relatively straight wiring structure can pass through the wiring structure during bending, stretching, and twisting. The hollowed-out area 11 of the hollowed-out unit 1 performs stress relief to prevent the wiring structure from breaking and affecting the failure of the devices on the substrate to which the wiring structure is applied. Moreover, in this embodiment, the hollow areas 11 of any two adjacent hollow units 1 at least partially overlap, that is, the area of ​​the connection position between the two hollow units 1 is relatively large, which can effectively avoid the wiring The structure breaks at the connection position of the two hollow units 1 in the process of bending, stretching, and twisting, thereby ensuring the yield of the wiring structure. Especially for flexible substrates, due to the nature of the flexible substrate itself, it is prone to bending. Using the wiring structure of the present invention can greatly improve the yield of the flexible substrate.

[0025] The wiring structure of this embodiment will be described in detail below in conjunction with specific implementations.

[0026] The first preferred implementation, such as Figure 1-3 As shown, the edge of each hollow unit 1 in the wiring structure is approximately rectangular, that is, the edge of the non-hollowed area 10 of the hollow unit 1 away from the hollowed area 11 is approximately rectangular, and the non-hollowed area 10 is close to the hollowed area 11. The edge can be approximately rectangular, rectangular, or other graphics. Specifically, the edge of the non-hollowed area 10 of the hollowed-out unit 1 away from the hollowed area 11 is approximately rectangular, that is, the edge of the non-hollowed area 10 includes two long sides and two short sides, and the two long sides are the first. The two short sides are the third side and the fourth side respectively; meanwhile, the non-hollowed areas 10 of any two adjacent hollowed-out units 1 do not overlap. At this time, the connection modes of any two adjacent hollow units 1 include the following three:

[0027] The first connection method, such as figure 1 As shown, the first side of the non-hollowed area 10 of one of any two adjacent hollowed-out units 1 and the second side of the non-hollowed area 10 of the other are at least partially overlapped.

[0028] The second connection method, such as figure 2 As shown, the third side of the non-hollowed area 10 of one of any two adjacent hollowed-out units 1 and the fourth side of the non-hollowed area 10 of the other are at least partially overlapped.

[0029] The third connection method, such as image 3 As shown, the first side of the non-hollowed area 10 of one of any two adjacent hollowed-out units 1 and the third or fourth side of the non-hollowed area 10 of the other are at least partially overlapped; similarly, The second side of the non-hollowed area 10 of one of any two adjacent hollowed-out units 1 and the third or fourth side of the non-hollowed area 10 of the other are at least partially overlapped.

[0030] The second preferred implementation, such as Figure 4 As shown, the shape of the edge of each hollow unit 1 in the routing structure is a D-shape, wherein any two adjacent hollow units 1 are centrally symmetrical figures, and the symmetric centers of the two The center point of the connection position of the person.

[0031] It should be noted that the shape of the edge of the hollow unit 1 in this embodiment is not limited to the above-mentioned approximate rectangle and D-shape, and can also be round, hexagonal and other shapes, as long as the side edges are at least partially The connection method of overlapping setting is sufficient. In this way, even if one connection point breaks during the process of bending, stretching, and twisting of the wiring structure, the normal connection of the wiring structure can be ensured through the connection at the remaining positions, and the failure of the device is further prevented.

[0032] Preferably, such as Figure 5 As shown, the routing in this embodiment adopts any of the above-mentioned hollowed-out units 1, but it may also include at least one bridge portion 2, which penetrates the hollowed-out area of ​​the hollowed-out unit and is connected to the non-hollowed area. The first end and the second end of the bridge portion 2 are respectively connected between two different positions of the edge of the hollowed-out area 11 of the hollowed-out unit 1. This setting method can effectively enhance the yield of the wiring structure.

[0033] Preferably, the materials of the hollow unit in this embodiment all include metal, so it can ensure that the wiring structure has good conductivity. Of course, other conductive materials can also be used, which will not be listed here.

[0034] Example 2:

[0035] This embodiment provides a display substrate, which includes a base and a wiring structure disposed on the base. The wiring structure may be any wiring structure in the first embodiment.

[0036] The display substrate in this embodiment is preferably a flexible substrate, that is, the base material used is a flexible material, such as polyimide (PI).

[0037] Since the wiring structure in the display substrate in this embodiment includes a plurality of hollowed-out units 1, during the process of bending, stretching, and twisting of the display substrate, the wiring structure can perform stress relief through the hollowed-out units 1 thereon. In order to avoid the occurrence of breakage, which may affect the failure of the device on the substrate to which the wiring structure is applied. Especially for flexible substrates, due to the nature of the flexible substrate itself, it is prone to bend. The use of the wiring structure in this embodiment can greatly improve the yield of the flexible substrate.

[0038] Example 3:

[0039] This embodiment provides a display device, which includes the display substrate in the second embodiment. Therefore, the performance of the display device of this embodiment is better.

[0040] Among them, the display device can be a liquid crystal display device or an electroluminescent display device, such as liquid crystal panels, electronic paper, OLED panels, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, navigators, etc., which have display functions. Products or parts.