Organic field-effect transistor memory with self-blocking layer structure and fabrication method of organic field-effect transistor memory

An organic field and barrier layer technology, applied in the field of organic field effect transistor memory and its preparation, can solve the problems of not extensive material sources, low data stability, low light response speed, etc., to improve storage performance and photosensitivity performance, high Storage density, the effect of improving storage density

Active Publication Date: 2017-07-25
NANJING UNIV OF POSTS & TELECOMM
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved: the present invention mainly proposes an organic field effect transistor memory with a self-blocking layer structure and its preparation method, which solves the problems in the prior art that the source of materials is not wide, the operating voltage is high, the photoresponse speed is low, and the storage density is low. Technical issues such as low and low data stability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic field-effect transistor memory with self-blocking layer structure and fabrication method of organic field-effect transistor memory
  • Organic field-effect transistor memory with self-blocking layer structure and fabrication method of organic field-effect transistor memory
  • Organic field-effect transistor memory with self-blocking layer structure and fabrication method of organic field-effect transistor memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Such as Figure 1-9 As shown, the first step: at 25°C, prepare polystyrene PS solution with a solution concentration of 5 mg / ml, and let it stand for 12 h in a solution where the solvent is toluene to make it evenly dispersed;

[0035] Step 2: Prepare polyvinylcarbazole PVK solution with a solution concentration of 5 mg / ml, and let it stand in a solution where the solvent is toluene for 2 hours to make it evenly dispersed;

[0036] Step 3: Dope the prepared PS solution and PVK solution according to the volume ratio of 1:1, 5:1, 10:1 and 1:0 respectively;

[0037] The fourth step: sequentially form a gate electrode and a gate insulating layer 4 on the substrate 5, the thickness of the gate insulating layer 4 is 300 nm, and make a substrate, and the substrate is ultrasonically cleaned with acetone, ethanol, and deionized water for 10 minutes in sequence, The ultrasonic frequency is 100 KHz, and then the liquid on the surface of the substrate is blown dry with high-purity...

Embodiment 2

[0052] Step 1: Prepare polymethyl methacrylate PMMA solution at 25°C with a solution concentration of 5 mg / ml, and let it stand in a solution with toluene as the solvent for 12 h to make it evenly dispersed;

[0053] Step 2: Prepare polyvinylcarbazole PVK solution with a solution concentration of 5 mg / ml, and let it stand in a solution where the solvent is toluene for 2 hours to make it evenly dispersed;

[0054] The third step: Dope the configured PMMA solution and PVK solution according to the volume ratio of 1:1, 5:1, 10:1 and 1:0 respectively;

[0055] The fourth step: sequentially form a gate electrode and a gate insulating layer 4 on the substrate 5, the thickness of the gate insulating layer 4 is 300 nm, and make a substrate, and the substrate is ultrasonically cleaned with acetone, ethanol, and deionized water for 10 minutes in sequence, The ultrasonic frequency is 100 KHz, and then the liquid on the surface of the substrate is blown dry with high-purity nitrogen to en...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an organic field-effect transistor memory with a self-blocking layer structure. A source-drain electrode, an organic photosensitive semiconductor layer, a gate insulation layer and a substrate are sequentially arranged from top to bottom, and a hybrid polymer self-blocking thin film layer is arranged between the organic photosensitive semiconductor layer and the gate insulation layer. The storage performance of the device is improved by a simple process means, so that the storage capacity, the switching speed and the tolerance of the device are greatly improved; and moreover, the fabrication cost of the device is reduced, and the promotion and application are convenient.

Description

technical field [0001] The invention belongs to the technical field of memory in the semiconductor industry, and in particular relates to an organic field effect transistor memory with a self-blocking layer structure and a preparation method thereof. Background technique [0002] As a basic component in electronic circuits, organic field-effect transistors are very suitable for the development direction of the next generation of wearable electronics industry because of their wide source of materials, lightness, and simple processing technology, and can be applied to large-area printing processes. At the same time, the structure of the organic field effect transistor determines that it has a wealth of functional applications, such as light emission, storage, sensing, switching, etc., so it has broad application prospects in the field of information electronics. [0003] In the charge transport layer there is a class of insulating materials that can permanently store charges...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/42H01L51/44H01L51/48B82Y30/00
CPCB82Y30/00H10K71/12H10K30/65H10K30/81Y02E10/549
Inventor 仪明东李焕群凌海峰解令海包岩宋子忆黄维
Owner NANJING UNIV OF POSTS & TELECOMM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products