Device and method for in-situ precision measurement of tiny holes in small and medium-diameter cylindrical components

Abstract

The present invention provides medium-small caliber cylindrical element micropore in-place precision measurement equipment and a method. The equipment comprises a medium-small caliber cylindrical element micropore machining device and an in-place detection device. The method comprises the steps of adopting the medium-small caliber cylindrical element micropore machining device as a control device during the measurement of a to-be-machined part, clamping, rotating and moving the to-be-machined part during the measurement process so as to avoid the error and the part damage caused by secondary clamping; cooperatively adopting a force sensor of high sensitivity as a signal feedback element, rotating a turntable and moving an X-directional guide rail pair to realize the high measurement accuracy; based on the movement of a gas static-pressure guide rail pair and the movement of the X-directional guide rail pair, realizing the high-accuracy measurement for the diameter dimension of a micropore; by means of a high-accuracy gas static-pressure turntable, detecting the roundness and the cylindricity and the micropore at a high accuracy; integrating and machining all the above data to realize the two-dimensional and three-dimensional error evaluation on detection data. In this way, the machining efficiency and the machining accuracy of the micropore are improved.

Description

technical field [0001] The invention relates to on-site precision measurement of microholes, in particular to an in-situ precision measurement device and method for small and medium-diameter cylindrical elements. Background technique [0002] With the rapid development of electronic communication, aerospace, national defense industry, medical equipment and other fields, the core components used are gradually advancing in the direction of miniaturization and precision, which has driven the development of my country's ultra-precision processing technology, but for these parts The precision measurement of components puts forward very high requirements, especially the measurement of tiny holes in cylindrical components with small and medium diameters is the most prominent. At present, all methods of measuring and observing the size and shape of tiny holes have obvious deficiencies: the three-coordinate measuring machine measurement method needs to take the part to the three-coord...

AI Technical Summary

Problems solved by technology

At present, all methods of measuring and observing the size and shape of tiny holes have obvious deficiencies: the three-coordinate measuring machine measurement method needs to take the part to the three-coordinate measuring machine for testing after processing, on the one hand, it increases the secondary equipment. The clamping process will introduce clamping errors. On the other hand, additional detection time will be added, which is time-consuming and laborious. For tiny holes with a diameter of less than 3mm, it is difficult for a three-coordinate measuring machine to detect; The diameter and roundness of tiny holes are measured, but the cylindricity cannot be measured; the method of aperture measuring instrument is suitable for use in processing, but the measurement accuracy is low, and the shape accuracy of tiny holes cannot be measured

In the process of micro-hole machining, if the error of the measurement result is large, it will cause high scrap rate and low processing consistency, which is extremely unfavorable for the development of ultra-precision machining of parts

Therefore, it is necessary to develop a device and measurement method for in-situ precision measurement of tiny holes in small and medium-diameter cylindrical components to solve the current problem of large errors in measurement accuracy of tiny holes

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