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Nano rubber-modified wet-heat resistant epoxy adhesive for LED backlight source and preparation method of nano rubber-modified wet-heat resistant epoxy adhesive

A technology of LED backlight and nano-rubber, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., to achieve the effect of low linear expansion coefficient, low CTE, and excellent comprehensive performance

Active Publication Date: 2017-08-11
无锡嘉联电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the increasing requirements of the LED industry on the comprehensive performance of products (especially the product's heat and humidity resistance), conventional epoxy resin potting adhesives are difficult to meet this situation, so the domestic market urgently needs a product that can meet or even exceed similar foreign products. Alternative Materials for Product Performance

Method used

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  • Nano rubber-modified wet-heat resistant epoxy adhesive for LED backlight source and preparation method of nano rubber-modified wet-heat resistant epoxy adhesive
  • Nano rubber-modified wet-heat resistant epoxy adhesive for LED backlight source and preparation method of nano rubber-modified wet-heat resistant epoxy adhesive
  • Nano rubber-modified wet-heat resistant epoxy adhesive for LED backlight source and preparation method of nano rubber-modified wet-heat resistant epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The raw material formula of the epoxy glue of embodiment 1 is as shown in table 1 below:

[0026] Table 1

[0027]

[0028]

[0029] The preparation method is:

[0030] Add low-viscosity epoxy resin GY271, hyperbranched modified epoxy resin R-270, and nano-rubber toughening agent MX-254 into the reaction kettle, and stir for 1.5 hours at 70°C to mix the materials evenly, and circulate water to make Cool the material below 30°C, then add defoamer BYK-A530, coupling agent KH-560, leveling agent BYK-354, thixotropic agent TS720 and mercaptan curing agent KarenzMT PE1 to the epoxy resin. Accelerators FXR-1020 and PN-23, stabilizers NP-100 and ICAM-8401, continue to stir for 30 minutes, then keep the vacuum degree <-0.08Mpa, vacuum degassing for 15 minutes, and divide the prepared materials into special The rubber tube is sealed to obtain the finished product, and the finished product is stored at a low temperature below -20°C.

[0031] Take the one-component epoxy ...

Embodiment 2

[0038] The raw material formula of the epoxy glue of embodiment 2 is as shown in table 3 below:

[0039] table 3

[0040]

[0041]

[0042] The preparation method is:

[0043] Add low-viscosity epoxy resin NPEF-170, hyperbranched modified epoxy resin R-270 and nano-rubber toughening agent W35 into the reaction kettle, and stir for 1 hour at 80°C to mix the materials evenly, and circulate water to make Cool the material below 30°C, then add defoamer TEGO Airex 900, coupling agent KH-550, leveling agent TEGO Glide100, thixotropic agent N20, mercaptan curing agent PETMP, and latent accelerator to the epoxy resin FXR-1030 and EH-4337S, stabilizer NP-100 and ICAM-8401, continue to stir for 50 minutes, then keep the vacuum degree <-0.08Mpa, vacuum degassing for 10 minutes, and divide the prepared materials into special rubber cylinders Sealing to obtain the finished product, and the finished product is stored at a low temperature below -20°C.

[0044] Take the one-component...

Embodiment 3

[0051] The raw material formula of the epoxy glue of embodiment 3 is as shown in table 5 below:

[0052] table 5

[0053] raw material name Mass percentage, % Remark DYF-170 25.0 Low Viscosity Epoxy Resin R-270 15.0 Hyperbranched Modified Epoxy Resin EXL-2655 14.0 Nano Rubber Toughener BYK-065 0.3 Defoamer KH-560 0.1 coupling agent BYK-310 0.5 leveling agent TS720 5.0 Thixotropic agent TMP-33 30.0 Mercaptan curing agent 2014AS 4.2 latent accelerator LH210 4.0 latent accelerator NP-100 0.4 low temperature stabilizer ICAM-8401 1.5 medium temperature stabilizer

[0054] The preparation method is:

[0055] Add low-viscosity epoxy resin DYF-170, hyperbranched modified epoxy resin R-270 and nano-rubber toughening agent EXL-2655 into the reaction kettle, stir at 60°C for 2 hours to mix the materials evenly, and circulate Cool the material below 30°C with water, then add de...

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Abstract

The invention discloses a nano rubber-modified wet-heat resistant epoxy adhesive for an LED backlight source and a preparation method of the nano rubber-modified wet-heat resistant epoxy adhesive. The epoxy adhesive is a single component, and comprises the following specific components: 20-26% of low-viscosity epoxy resin, 15-23% of hyperbranched modified epoxy resin, 10-15% of a nano rubber flexibilizer, 0.1-0.3% of an antifoaming agent, 0.1-0.5% of a coupling agent, 0.1-0.5% of a flatting agent, 4-6% of a thixotropic agent and 30-36% of a mercaptan curing agent, 5-11% of a latene accelerator and 0.8-2% of a stabilizer. A product is encapsulated by adopting a single-component epoxy adhesive material for the LED backlight source, so that the investment of production equipment and manpower can be reduced, the curing process is very short, the production efficiency of the product is greatly reduced, the production cycle of the product is greatly shortened, and meanwhile, the product is excellent in combination property, relatively good in electrical property and particularly prominent in wet-heat resistance and has a wide market prospect.

Description

technical field [0001] The invention relates to the technical field of epoxy resin curing agents, in particular to a heat-and-moisture-resistant epoxy glue for nano-rubber modified LED backlight and a preparation method thereof. Background technique [0002] Potting glue for LED backlight is a kind of fixed insulating potting glue widely used in LED application field. At present, potting glue for LED backlight can be roughly divided into three categories: polyurethane potting glue, silicone potting glue and epoxy resin potting compound. [0003] Polyurethane potting adhesives have excellent flexibility and low-temperature stability, but the temperature resistance under medium and high temperature conditions is obviously insufficient, which limits the application of polyurethane potting adhesives to a certain extent; the comprehensive performance of silicone potting adhesives is relatively low. Yes, it can meet the performance requirements of most products, but there are pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08
CPCC08L2201/08C08L2203/206C08L2205/025C08L2205/03C09J11/08C09J163/00C08L63/00C08L21/00
Inventor 刘敏卓虎
Owner 无锡嘉联电子材料有限公司