Magnetic control sputtering continuous line for preparing fuel cell metal bipolar plate non-crystalline carbon film

Abstract

The invention relates to a magnetic control sputtering continuous line for preparing a fuel cell metal bipolar plate non-crystalline carbon film. The magnetic control sputtering continuous line for preparing the fuel cell metal bipolar plate non-crystalline carbon film comprises a multi-cavity system, a work rest, a conveying system, an air-bleed system and isolating valve systems, wherein the multi-cavity system comprises four cavities of a cleaning and heating cavity, a first film-coating cavity, a second film-coating cavity and a follow-up processing cavity which are sequentially connected in series to form an integral part, and all the cavities communicate with each other; the work rest comprises at least one metal bipolar plate rack used for fixing and arranging a to-be-handled metal bipolar plate; the conveying system comprises conveying mechanisms used for sending the work rest into / out of the cavities in sequence; the air-bleed system comprises air-bleed mechanisms which are independently arranged in all the cavities and used for controlling the vacuum degree of all the cavities; and the isolating valve systems capable of being opened and closed are arranged on the transition parts between every two adjacent cavities, and in seal fit with the cavities. Compared with the prior art, the magnetic control sputtering continuous line for preparing the fuel cell metal bipolar plate non-crystalline carbon film is high in production efficiency, good in film quality and low in cost, and has an important significance for accelerating industrialization development of a fuel cell.

Description

technical field [0001] The invention relates to a continuous line for magnetron sputtering of amorphous carbon film, in particular to a continuous line for magnetron sputtering of amorphous carbon film for efficient preparation of metal bipolar plates of fuel cells. Background technique [0002] Vacuum coating technology first appeared in the 1930s, industrial applications began to appear in the 1940s and 1950s, and industrialized mass production began in the 1980s. It has achieved extensive results in electronics, transportation, aerospace, packaging, decoration, hot stamping and other industries. application. As one of the vacuum coating technologies, magnetron sputtering introduces a magnetic field on the surface of the target cathode and uses the magnetic field to confine the charged particles to increase the plasma density and increase the sputtering rate, realizing high-speed, low-temperature, and low-damage sputtering. It has the advantages of simple equipment, easy ...

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Problems solved by technology

However, during the coating preparation process, it was found that the existing coating preparation technology is inefficient, and the target material is polluted due to the preparation of multi-layer films, and frequent target washing is required to further reduce the coating preparation efficiency.

Chinese patent 200610049197.3 discloses a continuous sputtering equipment, which consists of five vacuum chambers, including a pre-pumping chamber, a front transition chamber, a sputtering chamber, a rear transition chamber, and a decompression chamber, as well as a film feeding table, a film output table, and a workpiece. The workpiece rack is transported out of the body to the film output table after passing through each chamber in turn, and then the workpiece rack is returned to the film feeding end by the workpiece rack return device outside the body. The defect of this equipment is that each chamber is connected to each other , but the working environment of each chamber process is different, so it is impossible to maintain different process conditions in different chambers, and at the same time, it will cause target contamination; The cavity is composed of two adjacent and connected vacuum chambers, the pre-pumping chamber and the sputtering chamber. An isolation valve is provided between the two vacuum chambers. Small footprint, but low productivity and unavoidable target contamination in the sputtering chamber

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