Glass insulator hermetically sealed packaging structure and welding method for microwave devices

A technology of glass insulators and hermetic packaging, which is applied to waveguide devices, electrical components, circuits, etc., can solve the problems of lower product quality, failure to prevent solder spreading, high equipment and labor costs, etc., to improve efficiency, reduce process control and The difficulty of production operation and the effect of reducing difficulty

Active Publication Date: 2022-07-08
成都玖信科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing insulator welding assembly method is used, the structure of the insulator assembly hole used has the following disadvantages: ①Since gold has a higher and faster solubility in the molten tin-based solder, the spreading speed of the tin-based solder on the gold-plated surface is relatively low. quick
For microwave devices whose surface is to be gold-plated, it is impossible to prevent the solder in the solder bath from spreading to the outer wall, which will affect the appearance of the product and reduce the quality of the product
②If you want to realize the welding of gold-plated insulators without solder spread, the process control is quite difficult, and the amount of solder, welding time, welding temperature curve, welding equipment, etc. need to be invested in high equipment and labor costs

Method used

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  • Glass insulator hermetically sealed packaging structure and welding method for microwave devices
  • Glass insulator hermetically sealed packaging structure and welding method for microwave devices

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Effect test

Embodiment 1

[0019] like Figure 1-2 As shown in the figure, a glass insulator hermetic packaging structure for a microwave device includes a gold-plated cavity wall 2 and a glass insulator 3. The glass insulator 3 is welded between the gold-plated cavity walls 2 and is located in the center, and the upper part of the gold-plated cavity wall 2 is adjacent to the upper part. A solder tank 1 is provided at the top, and a solder resist structure 4 is provided on the top of the solder tank 1 .

[0020] The solder resist structure 4 is of an L-step type, and the top is at the same level as the top of the gold-plated cavity wall 2 .

[0021] The height H of the solder resist structure 4 in the vertical direction is 0.05 mm, and the width W in the horizontal direction is 0.3 mm.

[0022] Both the vertical surface and the horizontal surface of the solder resist structure 4 are non-gold-plated surfaces, and the non-gold-plated surface is preferably an aluminum alloy surface.

Embodiment 2

[0024] A tin-free leakage welding method for a glass insulator airtight packaging structure of a microwave device, the method welds the glass insulator and the gold-plated cavity, and the method adopts the soldering resistance structure 4 provided on the top of the soldering tank 1 in Example 1 to prevent tin The base solder spreads toward the cavity walls.

[0025] In the present invention, due to the arrangement of the solder resist structure 4 on the aluminum alloy surface, since the aluminum alloy and the tin-based solder cannot form a wetted surface and cannot form welding, the solder resist structure 4 prevents the tin-based solder from spreading to the cavity wall, which greatly reduces the The difficulty of process control and production operation is improved, the sealing performance of the glass insulator hermetic packaging structure of the microwave device after welding is improved, the appearance after welding is beautiful, and there is no tin leakage.

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Abstract

The invention discloses a hermetic packaging structure of a glass insulator of a microwave device, which comprises a gold-plated cavity wall and a glass insulator, the glass insulator is welded between the gold-plated cavity walls and is located in the center, and the upper part of the gold-plated cavity wall is arranged near the top. The solder tank is provided with a solder resist structure on the top of the solder tank. Compared with the prior art, the invention prevents the tin-based solder from spreading to the cavity wall, greatly reduces the difficulty of process control and production operation, and improves the sealing performance of the glass insulator hermetic packaging structure of the microwave device after welding.

Description

technical field [0001] The invention relates to the field of small microwave devices, in particular to a glass insulator hermetically sealed packaging structure and a welding method for microwave devices. Background technique [0002] Most of the cavities of small microwave devices are aluminum alloys, and most of the surfaces are gold-plated. The RF input and output ends and feed or control ports of microwave devices are sintered with glass insulators. In order to achieve hermetic packaging of microwave devices, glass insulators and The combination of the cavity generally adopts the solder sintering assembly method. [0003] When the existing insulators are assembled by welding, the structure of the insulator assembly holes used has the following disadvantages: 1. Since gold has higher and faster solubility in the molten tin-based solder, the diffusion speed of the tin-based solder on the gold-plated surface is relatively high. quick. For microwave devices whose surface i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/00H01P11/00
CPCH01P1/00H01P11/00
Inventor 李杰周德钱
Owner 成都玖信科技有限公司
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