Nanofluid used for heat dissipation, preparation method and application of nanofluid
A nano-fluid and nano-particle technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of slow progress in research and development of new cooling materials, low efficiency and cost of thermoelectric modules, and difficulty in meeting the heat dissipation requirements of spectrometers. Application prospects and industrial production potential, low price, and the effect of low collision frequency
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[0026] The present invention also discloses the preparation method of the above-mentioned nanofluid. The basic liquid is prepared by fully mixing 85% by weight of distilled water and 15% of toluene, and adding 0.15—0.3% by weight of copper particles with a particle size of less than 100 nm to 99.6 —99.8% of the basic liquid, then add 0.05—0.1% of sodium lauryl sulfate to ensure that the weight ratio of the dispersant to the weight of the nanoparticles is less than or equal to 2. After 1.5-2 hours of ultrasonic vibration, a uniform and stable Cu / H 2 O nanofluid.
[0027] The invention also discloses the application of the above-mentioned nanofluid, which is used to dissipate heat from the shell of the spectrometer, and the speed of the nanofluid flowing into the heat dissipation device is greater than 1m / s and less than 5m / s.
Embodiment 1
[0028] Example 1: Under normal pressure, the boiling point of copper nanofluid of 0.15-0.3% by weight was measured. Such as figure 1 As shown, the boiling point temperature can reach 130.5-133.2°C.
Embodiment 2
[0029] Example 2: The thermal conductivity of copper nanofluid with a weight percentage of 0.15-0.3% at different temperatures was measured. Such as figure 2 As shown, the thermal conductivity of copper nanofluid is the highest at 130°C, and the thermal conductivity of the nanofluid with a weight percentage of 0.3% is 14.3% higher than that of the base liquid with a weight percentage of 0%.
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