Outer-cavity-type semiconductor laser structure

A semiconductor and laser technology, applied in the field of external cavity semiconductor laser structure, can solve the problems of reducing volume and weight, and achieve the effect of reducing volume and weight, rational structure layout, and solving complex structure

Active Publication Date: 2017-09-08
杭州诺驰生命科学有限公司
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the existing semiconductor laser technology, provide an external cavity semiconductor laser structure with reasonable component layout and compact structure, reduce the volume and weight, and solve the installation reference problem of the semiconductor laser , using the combination of heat sink and shielding shell to reduce the interference of the internal environment by external environment changes and improve the accuracy of semiconductor lasers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Outer-cavity-type semiconductor laser structure
  • Outer-cavity-type semiconductor laser structure
  • Outer-cavity-type semiconductor laser structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0026] The concrete implementation structure of a kind of external cavity type semiconductor laser structure of the present invention is as follows figure 1 As shown, it includes laser diode fixing plate 1, lens mounting base 2, sleeve tube 3, adjustable sleeve base 4, L-shaped bracket 5, grating fixing base 6, mirror fixing base 7, fixing screws, locks Clamp nut, shell 8, heat sink 9, base 10, semiconductor refrigerator 11. The lens mounting base 2 is used for the positioning and fixing of the laser diode and the collimating lens on the one hand, and on the other hand, it is installed in the casing 3 through the top thread; The positioning of the base 4 is fixed and compressed by the nut on the heat sink 9; the grating fixing base 6 is used to fix the grating and the free-stroke piezoelectric chip to realize the adjustment of the cavity lengt...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an outer-cavity-type semiconductor laser structure including a laser diode fixing sheet, a lens mounting base, a sleeve, an adjustable sleeve base, an L-shaped support, a grating fixing base, a reflector fixing base, a housing, a heat sink and a pedestal. The laser diode fixing sheet enables fixation of a laser diode and a lens mounting base with a thread structure. The lens mounting base enables coaxial arrangement of the laser diode and a straightening lens. The adjustable base is used for mounting a laser head and the fixed heat sink. The grating mounting base is used for fixing a grating and is fixed together with the L-shaped support so as to realize adjustment of the length of an outer cavity. The heat sink provides support and mounting reference for different parts of the laser. The housing and pedestal form a shielding cavity isolating the inner environment of the laser from the outer environment. The structure is reasonable in component layout and is compact and stable. The weight in reduced and the cost is lowered. Problems of structure complexity and mounting and dismounting uneasiness of an outer-cavity-type semiconductor laser is solved and the invention has significant engineering practical value.

Description

technical field [0001] The invention relates to a structure of an external cavity semiconductor laser, in particular a reasonable and compact layout of each component, which reduces the volume, weight and cost of the laser, and solves the problem that the structure of the external cavity semiconductor laser is complex and difficult to disassemble. The structure can be used to narrow the linewidth and improve the tunability of the laser. Background technique [0002] Since the 1980s, lasers have been widely used in optical and atomic experiments. With the application of experiments and the improvement of requirements, the demand for lasers with small size, light weight, long life, low power consumption and high reliability has become more and more urgent. . [0003] The laser used in the current experiment has certain defects, mainly because the frequency of the laser tube is very sensitive to changes in temperature and input current, and the existing semiconductor cavity is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/024
CPCH01S5/024H01S5/023H01S5/02326H01S5/0233H01S5/0235H01S5/02355
Inventor 全伟刘思喆翟跃阳李欣怡
Owner 杭州诺驰生命科学有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products