Solid wireframe modeling device

A wireframe and entity technology, applied in manufacturing auxiliary devices, processing and manufacturing, processing data acquisition/processing, etc., can solve the problems of unsuitable large-scale entity wireframe integrated modeling, troubles, etc., achieve diverse and fast shapes, and facilitate positioning and movement , High stability effect
CN107160669BInactive Publication Date: 2019-03-29HUAIYIN INSTITUTE OF TECHNOLOGY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUAIYIN INSTITUTE OF TECHNOLOGY
Publication Date
2019-03-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a solid wireframe modeling device, and relates to the technical field of solid wireframe modeling. The solid wireframe modeling device comprises a heating feed device on the lower portion and a modeling mechanism on the upper portion. The modeling mechanism comprises two automatic positioning devices and multiple locating modeling devices arranged up and down. Each locating modeling device comprises a square frame. A modeling frame is arranged in the middle of each square frame. The structures of the two automatic positioning devices are the same, and the two automatic positioning devices are located in front of and on the right portion of the locating modeling devices correspondingly. The automatic positioning device on the right portion comprises a vertical mounting shell. A guide groove is formed in the bottom end in a guide shell. A U-shaped swing rod is in sliding connection in the guide groove. The front side and the rear side of the swing rod are fixedly connected with locating push plates. A heat radiation device comprises a heat radiation fan mounted on the guide shell. The solid wireframe modeling device has the beneficial effects that a raw material wire is subjected to modeling through computer control, the modeling speed is high, and the solid wireframe modeling device is suitable for being used for large solid wireframe modeling.
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Description

technical field

[0001] The invention relates to the technical field of solid wireframe modeling. Background technique

[0002] 3D printing technology is becoming more and more mature, using computer data model for parameter control to realize layer-by-layer stacking printing modeling, but when performing solid wireframe modeling, traditional 3D printing technology has limitations, and general 3D printing devices are only suitable for For modeling printing of small items, when printing large objects or wireframes, it needs to be printed in sections and then stitched together, causing trouble, or a large-scale dedicated 3D printing device requires a large spatial range of displacement when working , to drive the discharge port to move, although it can adapt to general large-scale printing, but due to the need for assembly and coordination of large accessories such as positioning mobile frames, it will be subject to more restrictions, and it is not suitable for the integrated m...

Claims

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