Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy resin composition, film-like epoxy resin composition, cured product, and electronic device

A technology of epoxy resin and composition, applied in the direction of circuits, electrical components, electrical solid devices, etc., to achieve excellent operability and the effect of suppressing warpage

Active Publication Date: 2017-09-26
RESONAC CORP
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since molten resin is injected and molded, unfilled parts may occur when sealing a large area.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin composition, film-like epoxy resin composition, cured product, and electronic device
  • Epoxy resin composition, film-like epoxy resin composition, cured product, and electronic device
  • Epoxy resin composition, film-like epoxy resin composition, cured product, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0135] Hereafter, although an Example demonstrates this invention more concretely, the scope of the present invention is not limited to these Examples.

[0136]

[0137] The compounds shown in Table 1 and Table 2 were prepared as components constituting the film-like epoxy resin composition. The details of each component are shown below.

[0138] (A) epoxy resin

[0139] (Components that are liquid at 25°C)

[0140] A1: Bisphenol F-type epoxy resin (epoxy equivalent: 160, manufactured by Mitsubishi Chemical Corporation, trade name "jER806")

[0141] (Components that are not liquid at 25°C)

[0142] A2: Trifunctional naphthalene-type epoxy resin (epoxy equivalent: 182, manufactured by DIC Corporation, trade name "HP-4750", compound represented by formula (IV))

[0143] A3: Anthracene-type epoxy resin (epoxy equivalent: 179, manufactured by Mitsubishi Chemical Corporation, trade name "YX-8800")

[0144] (B) Resin with aromatic ring and hydroxyl group

[0145] (resin with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

An epoxy resin composition containing (A) an epoxy resin, (B) a resin having an aromatic ring and a hydroxy group, and (C) an inorganic filler, wherein (A) the epoxy resin includes an epoxy resin which is liquid at 25 DEG, (B) the resin having an aromatic ring and a hydroxy group includes a resin having a naphthalene ring and a hydroxy group, and the content of the epoxy resin which is liquid at 25 DEG is 30 mass% or more with respect to the total amount of (A) the epoxy resin and (B) the resin having an aromatic ring and a hydroxy group.

Description

technical field [0001] The present invention relates to an epoxy resin composition capable of embedding or sealing an electronic component or electronic device (for example, an electronic component or electronic device disposed on a printed wiring board), a film-like epoxy resin composition and a cured product, and Electronic devices using them. Background technique [0002] The miniaturization and thinning of semiconductor devices are progressing along with the thinner and shorter electronic equipment. The form of using a semiconductor device having almost the same size as a semiconductor element or the mounting form of stacking a semiconductor device on a semiconductor device (package on package) is prevalent, and it is predicted that the miniaturization and thinning of semiconductor devices will further advance in the future. [0003] As semiconductor elements continue to be miniaturized and the number of terminals increases, it becomes difficult to provide all external ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62H01L23/29H01L23/31
CPCC08G59/62H01L23/295H01L21/568H01L24/19H01L24/20H01L24/96H01L24/97H01L2224/12105H01L2924/3511C08L63/00C08J5/18C08L2203/162
Inventor 荻原弘邦野村丰渡濑裕介金子知世铃木雅彦鸟羽正也藤本大辅
Owner RESONAC CORP