Preparation method of zero shrinkage LTCC multi-layer ceramic substrate

A technology of multilayer ceramics and porous ceramics, which is applied in the preparation of zero-shrinkage LTCC multilayer ceramic substrates in the plane X\Y direction, and in the field of preparation of zero-shrinkage LTCC multilayer ceramic substrates, which can solve the difficulty of consistency control and shrinkage control. Poor precision, high material cost and other problems, to achieve the effect of loose material and equipment performance requirements, solve thermal uniformity, and simple preparation process

Active Publication Date: 2017-10-20
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The pressure-assisted sintering method is simple, but it has very high requirements on the equipment, it is difficult to control the consistency, and it is prone to problems such as cracking, sticking, and wrinkling.
The patents of pressure

Method used

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  • Preparation method of zero shrinkage LTCC multi-layer ceramic substrate
  • Preparation method of zero shrinkage LTCC multi-layer ceramic substrate

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0032] Example 1:

[0033] A method for preparing the zero-shrinkage LTCC multilayer ceramic substrate of the present invention, such as figure 1 As shown, including the following steps:

[0034] (1) Prepare dupont 951 LTCC green tiles, and carry out the pre-process operations of punching, printing and positioning.

[0035] (2) Cut the LTCC green ceramic sheet 5 obtained by the previous process operation into 70mm×70mm small pieces, laminate the small pieces into 10 layers in turn, and then place two 0.1mm thick AlN ceramic green ceramic sheets on the upper and lower sides of the laminate. Put a layer on it and heat-press it at a temperature of 80°C and a pressure of 15MPa for 2 hours to form a green porcelain body.

[0036] (3) First place a porous ceramic pressing plate 3 isolation layer on the upper and lower surfaces of the green porcelain body, and then place a porous silicon carbide pressing plate 2 on the upper and lower surfaces of the porous ceramic pressing plate 3 holding t...

Example Embodiment

[0041] Example 2:

[0042] A method for preparing the zero-shrinkage LTCC multilayer ceramic substrate of the present invention, such as figure 1 As shown, including the following steps:

[0043] (1) Prepare Ferro A6 LTCC green ceramic sheet, and carry out the pre-process work of punching, printing and positioning.

[0044] (2) Cut the green ceramic slices obtained in step (1) into 70mm×70mm small slices, stack them in 20 layers in sequence, and then place two 0.1mm thick AlN ceramic green ceramic slices on top of the stack. The temperature is 90°C and the pressure is 20MPa for 1 hour to form a green porcelain embryo.

[0045] (3) First place a porous ceramic pressing plate 3 on the upper and lower surfaces of the green porcelain body, and then place a porous silicon carbide pressing plate 2 on the upper and lower surfaces of the porous ceramic pressing plate 3 holding the green porcelain body, and place it under pressure. On the device.

[0046] (4) Start the temperature rise, and in...

Example Embodiment

[0050] Example 3:

[0051] A method for preparing the zero shrinkage LTCC multilayer ceramic substrate of the present invention includes the following steps:

[0052] (1) Prepare dupont 951 LTCC green tiles, and carry out the pre-process work of punching, printing and positioning.

[0053] (2) Cut the green ceramic sheet obtained in step (1) into 70mm×70mm small pieces, and use 10 layers to sequentially stack them, and then two pieces of 0.1mm thick Al 2 O 3 Put a layer of green ceramic slices on top and bottom of the laminate, and heat-press at a temperature of 100°C and a pressure of 15 MPa for 1 hour to form a green ceramic body.

[0054] (3) First place a porous ceramic pressing plate 3 on the upper and lower surfaces of the green porcelain body, and then place a porous silicon carbide pressing plate 2 on the upper and lower surfaces of the porous ceramic pressing plate 3 holding the green porcelain body, and place it under pressure. On the device.

[0055] (4) Start the temperatur...

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Abstract

The invention discloses a preparation method of a zero shrinkage LTCC multi-layer ceramic substrate. The preparation method comprises the following steps: preparing a green ceramic body through laminating, sequentially placing one porous ceramic pressing plate and one porous silicon carbide pressing plate on the upper surface and the lower surface of the green ceramic body, putting into a pressure device, firstly heating up and discharging rubber, then heating up and sintering while pressure-assisted sintering is adopted, and then removing surface covering, so that the zero shrinkage LTCC multilayer ceramic substrate is obtained. The preparation method disclosed by the invention is simple and practicable and low in cost, shrinkage consistency of products can be effectively controlled, and shrinkage inter-chip repeatability can be controlled to be minus or plus 0.05%.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and relates to a preparation method of a zero-shrinkage LTCC multilayer ceramic substrate, in particular to a preparation method of a zero-shrinkage LTCC multilayer ceramic substrate in plane X\Y directions. Background technique [0002] Due to the unique advantages of LTCC (low temperature co-fired ceramics) technology, LTCC technology has developed rapidly in recent years and is increasingly used in military, aerospace, aviation, electronics, computers, automobiles, medical and other fields. However, as the requirements for large circuit size and high-density integration performance continue to increase, the inherent shrinkage of ordinary LTCC substrates during sintering affects the accuracy of substrate assembly, which can no longer meet the reliability requirements of electronic products. Generally, the shrinkage of the plane size of LTCC raw porcelain materials after co-firing is 12%...

Claims

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Application Information

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IPC IPC(8): C04B35/638C04B35/645B32B18/00B32B37/10B32B37/06
CPCB32B18/00B32B37/06B32B37/10C04B35/638C04B35/645C04B2235/6562C04B2235/6567
Inventor 杨金邓斌万喜新周水清王学仕陈庆广何永平
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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