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Preparation method of fluorescent chip and its wavelength conversion device and display system

A wavelength conversion device and chip technology, applied in projection devices, optics, instruments, etc., can solve the problems of affecting the color and brightness of the outgoing light, being unsuitable for high-power light-emitting devices, affecting the light transmittance and absorptivity, etc. Improved luminous brightness, increased luminous brightness and durability, and the effect of facilitating heat dissipation of components

Active Publication Date: 2019-10-25
APPOTRONICS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technique, wavelength converting elements emit light in transmission (e.g. figure 1 In the light transmission direction 40), the thickness of the wavelength conversion element will affect the transmittance and absorption rate of light, thereby affecting the color and brightness of the outgoing light; usually in order to optimize the luminous performance, the thickness of the wavelength conversion element needs to be very thin, Therefore, the mechanical properties are poor; and it is difficult to directly prepare a thinner light-emitting element. Generally, a thicker wavelength conversion element is prepared first, and then thinned, so the process is complicated and the cost is high.
Secondly, since the wavelength conversion element is a transmissive light emitting device, the setting of the heat sink will affect its light output rate, so the wavelength conversion element is not suitable for high-power light-emitting devices

Method used

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  • Preparation method of fluorescent chip and its wavelength conversion device and display system
  • Preparation method of fluorescent chip and its wavelength conversion device and display system
  • Preparation method of fluorescent chip and its wavelength conversion device and display system

Examples

Experimental program
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Effect test

Embodiment 1

[0039] figure 2 It is a schematic diagram of a wavelength conversion device for a fluorescent chip according to an exemplary embodiment. The fluorescent chip according to the embodiment of the present disclosure can adopt such as figure 2 The illustrated wavelength conversion device converts at least part of the incident light into outgoing light having a wavelength different from that of the incident light, the wavelength conversion device comprising:

[0040] The isolation part 11, the isolation part 11 includes a first surface parallel to the main extension plane, the first surface is provided with grooves arranged in a matrix;

[0041] The functional part 12, the functional part 12 includes a plurality of functional units, and the plurality of functional units are correspondingly arranged in the groove of the isolation part 11,

[0042]Wherein, the plurality of functional units include a conversion unit for receiving incident light and converting it into outgoing light...

Embodiment 2

[0071] Figure 8 It is a flow chart of a method for preparing a wavelength conversion device for a fluorescent chip according to an exemplary embodiment. like Figure 8 As shown, the method for preparing a wavelength conversion device for a fluorescent chip according to an embodiment of the present disclosure may include:

[0072] Step S11, integrally forming an isolation part having a plurality of grooves arranged in a matrix on the first surface parallel to the main extension plane;

[0073] Step S12 , filling the plurality of grooves with functional materials to form functional parts, where the functional materials are at least one of wavelength conversion materials, scattering materials and light-transmitting materials.

[0074] According to the method for manufacturing a wavelength conversion device for a fluorescent chip according to an embodiment of the present disclosure, it is possible to integrally form an isolation portion having a plurality of grooves arranged in...

Embodiment 3

[0105] According to an embodiment of the present disclosure, there is also provided a display system using the above-mentioned fluorescent chip, the display system includes: a light source, and the above-mentioned fluorescent chip, the light source is located near the first surface of the fluorescent chip One side is used to emit excitation light, the functional part of the fluorescent chip receives the excitation light and generates the received light in different wavelength ranges, and the received light is emitted from the opening of the groove.

[0106] For example, the display system may include a light source and a fluorescent chip, and the fluorescent chip is the fluorescent chip described in any one of the above embodiments. The light source is used to emit excitation light. For example, the light source can be LD array, LED, laser diode, laser, etc. The excitation light generated by the light source is shaped by a shaping device to form a uniform light spot, and the li...

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PUM

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Abstract

A fluorescent chip, a manufacturing method for a wavelength conversion apparatus thereof, and a display system. The fluorescent chip comprises the wavelength conversion apparatus used for converting at least a portion of an incident light into an emitted light different in wavelength from the incident light. The wavelength conversion apparatus comprises: a separation part (11) comprising a first surface parallel to a primary extension plane and provided with grooves in a matrix arrangement; a functional part (12) comprising multiple functional units correspondingly provided in the grooves of the separation part (11), the multiple functional units comprising a conversion unit used for receiving the incident light and converting same into the emitted light different in wavelength from the incident light; and the separation part (11) being used for reflecting an ultraviolet light and / or visible light. This allows the incident light to be converted into the emitted light by the functional part (12) and to be reflected by the separation part (11); employs reflected light emission, places no strict requirement on the thickness, and provides great mechanical performance; facilitates the provision of a cooling component, and is applicable in a high-power light-emitting device and a display system.

Description

technical field [0001] The present disclosure relates to the display field, in particular to a method for preparing a fluorescent chip and a wavelength conversion device thereof, and a display system. Background technique [0002] In the current display field, a display method mainly uses a DMD or an LCD as a light modulator to modulate illumination light to obtain image light. In the related art, in a display device that excites a fluorescent material with a laser to generate polychromatic light as a light source, the light emitted by the laser light-emitting element reaches the phosphor through an optical element (such as a light-combining device, a beam shaping device, etc.) (efficiency is, for example, about 90 %), the so-called illumination light is obtained after being converted by fluorescent materials; coupled to the optical-mechanical system (efficiency is, for example, about 94%); modulated into image light by the optical-mechanical system (optical-mechanical effic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03B21/20H01L33/50
CPCG03B21/204H01L33/50
Inventor 胡飞徐梦梦李屹
Owner APPOTRONICS CORP LTD