Polyimide film stripping method based on multilayer graphene as sacrificial layer

Abstract

The invention belongs to the technical field of new application, and particularly relates to a polyimide film stripping method based on multilayer graphene as a sacrificial layer, and provides the polyimide film stripping method based on multilayer graphene as the sacrificial layer. A plurality of layers of graphene films are arranged between a substrate and a polyimide film to obtain a substrate / a plurality of layers of graphene films / polyimide film stacked layer. The graphene film is taken as the sacrificial layer, the Van der Waals' force between layers of the graphene film is broken through external force by virtue of weak Van der Waals' force between the layers of the graphene film and the polyimide film is stripped from the substrate. Van der Waals' force connection exists among thegraphene layers, the graphene layers can slide like graphite, and the adhesion effect between the polyimide film and the glass substrate after high temperature can be effectively weakened by means ofthe property. The stripping method is simple and stable in stripping effect without influencing the properties of the polyimide film.

Description

technical field [0001] The invention belongs to the field of new application technologies, and more specifically relates to a polyimide film stripping method based on multilayer graphene as a sacrificial layer. Background technique [0002] In recent years, with the acceleration of the upgrading of the display industry, the demand for large-size flexible organic light-emitting diodes (OLEDs) will grow explosively, which will also drive the development and demand of flexible substrates. More flexible substrates currently used mainly include polymer plastics such as polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN). The above plastics have high transmittance (>85%), but all have a fatal disadvantage: poor heat resistance (Tg<120°C), and poor solvent resistance. It is well known that low-temperature polysilicon technology (LTPS), a necessary processing step in the preparation of large-scale flexible OLEDs, requires high processing t...

AI Technical Summary

Problems solved by technology

[0007] For the above defects or improvement needs of the prior art, the invention provides a polyimide film peeling method based on multilayer graphene as a sacrificial layer, which is achieved by arranging multilayer graphite between the substrate and the polyimide film. Graphene film, using graphene as a sacrificial layer, weakens the adhesion force between the polyimide film and the substrate by virtue of the weak van der Waals force between the multi-layer graphene layers, and the polyimide film is separated from the substrate The peeling method solves the technical problems of complex peeling methods for polyimide films, low peeling efficiency or damage to polyimide films in the prior art

Images