Modular IGBT liquid-cooled plate and manufacturing method thereof

Abstract

The invention discloses a modular IGBT liquid-cooled plate and a manufacturing method thereof. The IGBT liquid-cooled plate comprises a substrate. First and second liquid flow tanks are arranged in series in the upper end of the substrate. The first liquid flow tanks are provided in a communication manner with a liquid inlet flow path, and the second liquid flow tanks are provided in a communication manner with a liquid outlet flow path. The first and second liquid flow tanks are connected through an intermediate liquid flow path. The first and second liquid flow tanks are both formed by connection of a plurality of liquid flow grooves of the same size in parallel. A sealing ring for sealing IGBT modules is arranged above the substrate. A cover plate covering the substrate and the sealing ring is arranged above the substrate. In the invention, the channel flow distribution under each IGBT module is uniform through the IGBT liquid-cooled plate, the surface of the liquid-cooled plate has good temperature uniformity, the pressure drop of the inlet and outlet is controlled within a reasonable range, the heat dissipation is high, and the overall sealing property is good.

Description

technical field [0001] The invention relates to heat dissipation technology of electronic devices, in particular to a modular IGBT liquid cooling plate and a manufacturing method thereof. Background technique [0002] With the increasing heat flux density of electronic device packaging, it is difficult for a single-channel cold plate structure to meet its heat dissipation requirements. For the design of mesoscale cold plate structures, multi-channel cold plate structures are increasingly favored by researchers. With the development of the new energy industry, IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor or high-power switching device) has gradually been widely used as a high-power switching device. The IGBT module is mainly a package for a series of chips. The internal chips are IGBT chips and diode chips, which are often accompanied by high heat flux in the actual working process. Therefore, the failure of the IGBT module is mainly due to overh...

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Problems solved by technology

The traditional flow channel has the following disadvantages: (1) In the S-type single-channel or multi-channel structure in series, the inlet and outlet pressure loss along the way is relatively large, which will cause a large pressure drop, so the power requirement for the circulating pump of the liquid cooling system is high , the required cost increases accordingly (2) The traditional cold plate structure is likely to cause a large temperature difference on the surface of the cold plate when the inlet and outlet channels are too long, which may easily lead to uneven distribution of thermal stress and failure; (3) the traditional cold plate The structure is only designed for a certain number of IGBT modules. When the number of modules increases or decreases, the cold plate structure needs to be redesigned, which does not have good versatility

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