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Substrate Unit And Method Of Manufacturing Substrate Unit

A manufacturing method and substrate technology, which can be used in printed circuit manufacturing, electrical components, electrical equipment structural parts, etc., can solve problems such as temperature rise, achieve the effect of improving heat dissipation and suppressing manufacturing costs

Inactive Publication Date: 2017-10-20
YAMATAKE HONEYWELL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the case of a Zener diode, after it is actually mounted on a wiring board (printed circuit board), in an electric power application test conducted for the evaluation of basic safety and explosion-proof performance, a temperature rise exceeding the rating may occur, and additional heat dissipation may be required. Countermeasures

Method used

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  • Substrate Unit And Method Of Manufacturing Substrate Unit
  • Substrate Unit And Method Of Manufacturing Substrate Unit
  • Substrate Unit And Method Of Manufacturing Substrate Unit

Examples

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Embodiment Construction

[0033] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0034] figure 1 It is a top view schematically showing the structure of the board|substrate unit which concerns on one Embodiment of this invention.

[0035] figure 1 The illustrated substrate unit 100 is an electronic circuit module in which an electronic circuit constituting a part of an industrial product requiring a basic safety explosion-proof structure is formed on a wiring substrate. The substrate unit 100 has a wiring substrate 1 , electronic components and metal components mounted on the wiring substrate 1 , and a resin film 7 .

[0036] The wiring substrate 1 is, for example, a printed circuit board, and a wiring pattern as a metal wiring made of a metal material (for example, a metal material including copper) is formed on the surface (back surface) of the substrate or inside the substrate. exist figure 1 In FIG. 3 , wiring patterns 3A to 3F are illustrat...

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Abstract

The present invention relates to a substrate unit and a method of manufacturing the substrate unit and aims to improve the radiating capability of the substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs. The substrate unit 100 includes the wiring substrate 1, electronic components as safety maintaining devices which are arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film 7 covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0W / mk and a dielectric breakdown strength of at least 3.0kV / mm.

Description

technical field [0001] The present invention relates to a board unit in which electronic components are mounted on a wiring board, for example, to a board unit mounted on a positioner or the like requiring a basic safety and explosion-proof structure, and a method of manufacturing the board unit. Background technique [0002] Industrial products used in chemical plants, such as positioners and pressure signal transmitters used to control flow rate control valves, are sometimes used in explosive atmospheres filled with flammable gases, so basic safety is required Explosion-proof structure. [0003] As one of the requirements for certifying an industrial product as a basic safety explosion-proof structure, it is necessary to design electronic components that limit electric energy such as Zener diodes used inside industrial products to be safe to operate while suppressing the total amount of electric energy below a specified value. Holding parts (standard IEC60079-11). [000...

Claims

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Application Information

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IPC IPC(8): H05K1/02H01L23/373H01L23/367
CPCH01L23/367H01L23/3737H05K1/0209H05K2201/062H05K1/0262H05K3/284H05K2201/10174H05K3/0091H05K7/205H05K7/209H05K2201/068H05K2203/125H05K2203/16
Inventor 名古屋博昭
Owner YAMATAKE HONEYWELL CO LTD
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