Dispensing machine with accurate positioning performance and consistent dispensing quantity

Abstract

The invention discloses a dispensing machine with accurate positioning performance and consistent dispensing quantity. The dispensing machine comprises a frame assembly body, an x-axis assembly body, a y-axis assembly body, a z-axis assembly body and a glue outlet assembly body; the frame assembly body comprises a square frame, a left bracket and a right bracket, and the left bracket and the right bracket are mounted on the two sides of the back of the square frame; horizontal operation platforms are mounted on the left and right sides of the square frame, the x-axis assembly body is mounted between the two horizontal operation platforms, the two ends of the y-axis assembly body are connected with the upper end of the left bracket and the upper end of the right bracket respectively, the z-axis assembly body is mounted on the y-axis assembly body, and the glue outlet assembly body is mounted on the front side of the z-axis assembly body; a workpiece platform is mounted on the upper side of the x-axis assembly body, an x-axis displacement sensor is mounted on the left side of the front end of the x-axis assembly body, a y-axis displacement sensor is mounted on the lower side of the right end of the y-axis assembly body, and a z-axis displacement sensor is mounted on the left side of the lower end of the z-axis assembly body. The dispensing machine has the advantages that positioning can be accurate, the dispensing quantity is consistent, the scrap rate of parts is reduced, and the glue is saved.

Description

technical field [0001] The invention relates to a glue dispensing machine, in particular to a glue dispensing machine with precise positioning and consistent glue output. Background technique [0002] With the rapid development of science and technology, people's requirements for electronic equipment are getting higher and higher, making electronic equipment tend to be more and more intelligent, and integrated circuits in electronic equipment are also developing towards high-density integration. Various packaging fluids are used in the semiconductor packaging process on integrated circuit boards to mechanically protect chips and relieve thermal stress. In the packaging process, it is generally completed by dispensing, so the requirements for dispensing machines are getting higher and higher. In actual production, a dispensing machine is required for dispensing, such as dispensing of integrated circuit boards on mobile phones, ranging from automotive parts to electronic comp...

AI Technical Summary

Problems solved by technology

Therefore, it often leads to production that cannot meet the needs of customers, and what is more, it leads to an increase in the unqualified rate of circuit boards, which can lead to

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