A feature automatic recognition method for laser grooves formed by laser processing

Abstract

The invention proposes a method for automatically recognizing features of a laser groove formed by laser processing, and the method comprises the steps: employing a three-dimensional detection system to obtain a digital image corresponding to a real height, such as a white-light vertical scanning interference contourgraph, wherein the longitudinal resolution of the digital image is less than 1.0nm, and the highest lateral resolution can reach 0.35 microns, i.e., enabling each pixel to be corresponding to one height value. The digital image processing technology is employed for the recognition of the groove, and the width and depth of the groove are calculated. The above detection is carried out after the laser groove is formed by the laser processing, so the detection cannot be affected by the physical impact of laser processing, and the estimation accuracy and reliability of the laser groove can be improved.

Description

technical field [0001] The invention relates to the field of laser processing. Background technique [0002] Laser processing technology has been widely used in many fields of manufacturing. In recent years, with the further development of advanced manufacturing fields such as integrated circuit process technology and high-efficiency solar cell technology, the ability of micro-nano laser processing technology to display features in these fields has become an irreplaceable enabling technology in these fields. For example, in the manufacture of integrated circuits, the wafer itself is very thin, and the dicing process involves a series of problems, such as how many chips can be cut from a wafer, or how to cut complex integrated circuit chips without causing defects. As final chip products become smaller and smaller with more advanced features, the dicing process must work under increasingly stringent conditions. Due to the limitation of the size of the mechanical blade and t...

AI Technical Summary

Problems solved by technology

There are great shortcomings in the detection method of laser cutting instruments: on the one hand, the cutting instrument can only measure the width, but not the depth; There are some deviations caused by physical reactions (such as thermal effects, etc.), which make the test data inaccurate

But the measured laser groove width and depth must be found and determined artificially after measurement

Such a measurement operation greatly increases the measurement time. At the same time, due to manual search, the measured parameters are subject to the subjective influence of the operator, resulting in unsatisfactory stability and repeatability of the measurement.

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