Circuit device and method of manufacturing the same
A technology of circuit devices and hybrid circuits, which is applied in the direction of circuit heating devices, printed circuit manufacturing, circuits, etc., can solve the problems of rising costs and hindering the miniaturization of hybrid integrated circuit devices 100, and achieve the effect of preventing short circuits
Inactive Publication Date: 2017-10-27
SEMICON COMPONENTS IND LLC
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0006] However, in the hybrid integrated circuit device 100 having the above-mentioned structure, if a circuit for converting a large current such as an inverter circuit is formed on the upper surface of the substrate 101, the width of the conductive pattern 103 for securing the current capacity needs to be enlarged, which hinders miniaturization of hybrid integrated circuit device 100
In addition, in order to ensure heat dissipation, it is necessary to prepare a heat sink for each semiconductor element, which also leads to an increase in cost
Method used
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Embodiment Construction
[0022] Below, refer to Figure 1 to Figure 5 , the configuration of a hybrid integrated circuit device 10 as an example of a circuit device will be described.
[0023] First, the configuration of a hybrid integrated circuit device 10 according to this embodiment will be described with reference to FIG. 1 . FIG. 1(A) is a perspective view of the hybrid integrated circuit device 10 viewed obliquely from above. FIG. 1(B) is a cross-sectional view of a hybrid integrated circuit device 10 .
[0024] Referring to Fig. 1 (A) and Fig. 1 (B), hybrid integrated circuit device 10 has: circuit board 12, the lead wire 18,20 that is arranged on the circuit board 12, the transistor 22 that is installed on the guide portion 28 of lead wire 18 and The diode 24 (circuit element), and the sealing resin 16 integrally seal the circuit board 12 , the leads 18 , 20 , the transistor 22 , and the diode 24 .
[0025] The circuit board 12 is a metal substrate mainly made of metal such as aluminum (Al...
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Abstract
The present invention discloses a circuit device and a method of manufacturing the same. This circuit device is a small circuit device with good heat dissipation. In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
Description
[0001] This application is a divisional application of an invention patent application with an application date of September 23, 2011, an application number of 201110284769.7, and an invention title of "circuit device and its manufacturing method". technical field [0002] The present invention relates to a circuit device and a manufacturing method thereof, and more particularly to a circuit device incorporating a power semiconductor element for switching a large current and a manufacturing method thereof. Background technique [0003] Below, refer to Figure 9 The configuration of a conventional hybrid integrated circuit device 100 will be described (see Patent Document 1 below). On the surface of the rectangular substrate 101, a conductive pattern 103 is formed via an insulating layer 102, and circuit elements are fixedly mounted on the conductive pattern 103 to form a predetermined circuit. Here, the semiconductor element 105A and the chip element 105B are connected to th...
Claims
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IPC IPC(8): H01L21/56H01L23/31H01L23/433H01L23/495H01L23/49H01L25/07
CPCH01L21/565H01L23/3121H01L23/4334H01L23/49531H01L23/49575H01L25/072H01L24/48H01L24/45H01L2224/32245H01L2224/45015H01L2224/45124H01L2224/73265H01L2224/48091H01L2224/48139H01L2224/48137H01L2224/48247H01L2224/48472H01L2924/13055H01L2924/14H01L2924/181H01L2924/19107H01L2924/19105H01L2924/00014H01L2924/00H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755H01L2924/20756H01L2924/20757H01L2924/20758H01L2924/20759H01L2924/2076H01L2924/00012H01L2224/45014Y10T29/4916H01L2224/48096H01L2924/206H01L23/495H01L23/49811H01L23/58H01L24/43H01L24/46H01L25/0652H01L25/0657H05K3/284H01L21/4825H01L21/56H01L23/293H01L23/49541H01L24/85H01L25/18H01L25/50H01L2224/48106H01L2924/1203H01L2924/13091H02M7/537H05K1/0203H05K1/181
Inventor 真下茂明堀内文夫工藤清昭樱井章稻垣裕纪
Owner SEMICON COMPONENTS IND LLC