Encapsulation structure with increased non-functional chip, and manufacturing process thereof

Abstract

The invention relates to an encapsulation structure with an increased non-functional chip. The encapsulation structure comprises a copper substrate, a functional chip, a non-functional chip, a gold wire and insulating resin; the copper substrate is provided with a top surface and a bottom surface, which are opposite; the functional chip is configured on the top surface of the copper substrate or over the non-functional chip; the non-functional chip is configured over and below the functional chip or on the side surface of the functional chip, wherein when the non-functional chip is positioned below the functional chip and on the side surface of the functional chip, the non-functional chip is connected with the copper substrate; the gold wire is used for connecting the functional chip with the copper substrate; and the insulating resin is used for fully filling the encapsulation space of the encapsulation structure with the increased non-functional chip. According to the encapsulation structure with the increased non-functional chip, and the manufacturing process thereof disclosed by the invention, the production technology process is simple; therefore, the comparative advantage of the cost is obtained; furthermore, for different encapsulation requirements of thin chips of different thicknesses, recycling of the chip can be solved by adjusting the factors of the non-functional chip, such as the position, the size and the thickness; the profit is maximized; and thus, the practical production processing requirements are satisfied.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging in microelectronic technology, and in particular relates to a packaging structure and manufacturing process for adding non-functional chips. Background technique [0002] With the development of modern technology, in order to meet the requirements of different memory capacities, more and more packaging methods are from 1D>2D>4D>8D..., and the chips used are getting thinner and thinner, but the current product appearance size is fixed , after adjusting the internal structure, it is necessary to design a packaging structure and manufacturing process that can meet the product packaging requirements of different functional chip thicknesses and solve the problem of product warpage, so as to maximize profits and ensure the reliability of the packaging mechanism . Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of th...

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Problems solved by technology

[0002] With the development of modern technology, in order to meet the requirements of different memory capacities, more and more packaging methods are from 1D>2D>4D>8D..., and the chips used are getting thinner and thinner, but the current product appearance size is fixed , after adjusting the internal structure, it is necessary to design a packaging structure and manufacturing process that can meet the product packaging requirements of different functional chip thicknesses and solve the problem of product warpage, so as to maximize profits and ensure the reliability of the packaging mechanism

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