Heat dissipation material and preparation method of electronic equipment, electronic equipment and heat dissipation method

A technology of electronic equipment and heat dissipation materials, applied in heat exchange materials, chemical instruments and methods, circuits, etc., can solve problems such as poor experience, transmission, and temperature rise of the whole machine, so as to improve user experience and achieve good heat dissipation effects Effect

Active Publication Date: 2019-08-27
GUANGDONG XIAOTIANCAI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for smart watches using 3G and above chips, due to the small size of the whole machine and the waterproof level of 7 or above, it is difficult to transfer heat through conduction, radiation and convection, which makes the temperature of the whole machine rise and the user experience is poor.

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  • Heat dissipation material and preparation method of electronic equipment, electronic equipment and heat dissipation method

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0025] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should ...

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Abstract

The invention belongs to the technical field of heat dissipation of electronic equipment and discloses a heat dissipation material for an electronic device, a preparation method, an electronic device and a heat dissipation method. The heat dissipation material comprises a middle heat storage sustained release layer and a heat dissipation layer. The middle heat storage sustained release layer comprises a pasty mixture layer and a heat dissipation film. The pasty mixture layer comprises graphite powders and paraffin powders. The mass percentage of the graphite powders is 20% to 50%. The mass percentage of the paraffin powders is 40% to 70%. The electronic device contains the heat dissipation material therein. The heat dissipation method uses the heat dissipation material. The preparation method comprises the following steps of: cutting the heat dissipation film; disposing a pasty mixture containing 20% to 50% graphite powders by mass and 40% to 70% of paraffin powders by mass on the heat curing glue of the heat dissipation film. The heat dissipation material for the electronic device, the preparation method, the electronic device and the heat dissipation method can restrict the operating temperature of the electronic chip within a certain value and achieve good user experience.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic equipment, and in particular relates to a heat dissipation material for electronic equipment and a preparation method, electronic equipment and a heat dissipation method. Background technique [0002] At present, there are three ways for smart watches to dissipate heat. They are: 1. By setting heat-dissipating graphite or copper foil materials at places where heat sources are concentrated, transferring heat between other objects to share heat; 2. Radiation; 3. Air convection. However, for smart watches using 3G and above chips, due to the small area of ​​the whole machine and the waterproof level above 7, it is difficult to transfer heat through conduction, radiation and convection, which makes the temperature of the whole machine rise and the user experience is poor. Contents of the invention [0003] The object of the present invention is to overcome the deficiencies of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373C09K5/14
Inventor 梁华锋
Owner GUANGDONG XIAOTIANCAI TECH CO LTD
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