Device for eliminating high electric field
A high electric field and device technology, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as device breakdown, affecting device withstand voltage, and charge imbalance, so as to improve breakdown voltage, increase current capability, reduce The effect of small channel resistance
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Embodiment 1
[0032] Such as figure 1As shown, a device for eliminating high electric fields is characterized in that its cell structure includes a substrate 1, a source contact electrode 5, a drain contact electrode 6, a gate electrode 7, a gate oxide layer 8, and a second type drift region 9. Second type strips 12, first type strips 14, second type buffer regions 22, first type well regions 24, second type heavily doped regions 32, first type heavily doped regions 34, third type heavily doped regions doping region 42; the second type drift region 9 is arranged on the upper surface of the substrate 1; the first type well region 24 is embedded and arranged on the left side of the second type drift region 9, and its upper surface is connected with the second type The upper surface of the drift region 9 is connected; the second type buffer region 22 is embedded on the right side of the second type N-type drift region 9, and its upper surface is connected with the upper surface of the second t...
Embodiment 2
[0034] Such as figure 2 As shown, this embodiment is basically the same as Embodiment 1, the difference is that: under the first type well region 24, the left end of the junction of the substrate 1 and the second type drift region 9 is introduced into the first type buried layer 3, and its upper surface The first type well region 24 is partially embedded, and the lower surface is partially embedded in the substrate 1; thereby preventing the first type well region 24 from communicating with the substrate 1, thereby improving the stability of the device.
Embodiment 3
[0036] Such as image 3 As shown, the present embodiment is basically the same as Embodiment 1, the difference is that the second type bar 12 and the first type bar 14 are arranged in the body of the second type drift region 9, and the upper surface thereof is not in contact with the upper surface of the second type drift region 9. The surface is connected, and the lower surface is not connected with the lower surface of the second type drift region 9 .
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