Novel printed circuit board type heat exchanger based on 3D printing technology

Abstract

The invention discloses a novel printed circuit board type heat exchanger based on a 3D printing technology. The novel printed circuit board type heat exchanger based on the 3D printing technology comprises a heat exchange main body formed on the basis of the 3D printing technology, wherein two ends of the heat exchange main body are a first heat exchanger inlet and outlet section and a second heat exchanger inlet and outlet section separately; a thermal fluid inlet channel and a cold fluid outlet channel are formed in the first heat exchanger inlet and outlet section in the vertical direction; a thermal fluid outlet channel and a cold fluid inlet channel are formed in the second heat exchanger inlet and outlet section in the vertical direction; a plurality of layers of periodic heat exchange channels are formed in the middle of the heat exchange main body from bottom to top; part of the periodic heat exchange channels communicate with the thermal fluid inlet and outlet channel; and the rest of periodic heat exchange channels communicate with the cold fluid inlet and outlet channel. The 3D printing technology is adopted, the whole heat exchanger is formed integrally, and loss of drainage, resistance and the like due to manufacturing errors can be reduced.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a novel printed circuit board heat exchanger based on 3D printing technology. Background technique [0002] With the vigorous development of turbomachinery and nuclear energy industry, the heat load of the key equipment of the system is getting higher and higher. As a heat dissipation equipment widely used in the energy field, the heat exchanger is also facing severe challenges. Printed circuit board heat exchanger (PCHE) is a compact heat exchanger with excellent heat transfer performance and high efficiency. There are many periodic channels tightly arranged on the heat exchange plate, and different kinds of hot and cold fluids (air, helium) Gas, water and supercritical carbon dioxide, etc.) flow in the semi-circular section of the channel, and heat exchange occurs, PCHE has a very high heat exchange capacity per unit volume. [0003] The heat exchange plates of...

AI Technical Summary

Problems solved by technology

This preparation method limits the development of channel forms and slows down the industrialization of various new channels. At present, a large number of Z-shaped and S-shaped channels with semicircular cross-sections are used. Although these channels are simple in form, they will produce obvious drag loss

In addition, the plate stacking method will inevitably have manufacturing deviations in the heat exchanger preparation process, resulting in fluid leakage loss and additional resistance loss, which reduces the heat transfer performance of the heat exchanger to a certain extent

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