Method and device for stripping adhesive film from wafer

Abstract

The invention relates to a method for stripping an adhesive film from a wafer. The method comprises the following steps of putting the wafer with the adhesive film on a wafer support table in an inclined state, wherein the wafer support table comprises a base and an inclined support surface for accommodating the wafer; stripping the adhesive film on the wafer from the edge of the wafer by using a blade; pressing the wafer on the wafer support table by using a press handle and simultaneously stripping the adhesive film from the wafer by using tweezers; and optionally, after putting the wafer with the adhesive film on the wafer support table in the inclined state and before stripping the adhesive film on the wafer from the edge of the wafer by using the blade, carrying out debonding treatment on the wafer with the adhesive film put on the wafer support table. The invention further relates to a device for stripping the adhesive film from the wafer.

Description

technical field [0001] The present invention relates to the field of semiconductor wafers, and more particularly, to methods and devices for removing adhesive films from semiconductor wafers. Background technique [0002] In the field of semiconductors, in the manufacture of substrate wafers (for example, after cutting out the rough wafer from the produced ingot, it is necessary to perform steps such as edging, grinding and polishing on the rough wafer) and subsequent epitaxial growth and thinning processing, storage and transportation. , it is possible to paste a mucous membrane on one or both sides of the wafer (that is, a mucous membrane formed by coating an adhesive on a plastic base film. After the mucous membrane is irradiated with light, the adhesive loses its viscosity; the commonly used mucous membrane is an ultraviolet (UV) film. The UV adhesive applied on the film loses its viscosity after being irradiated with ultraviolet light. The process of irradiating light t...

AI Technical Summary

Problems solved by technology

When the film is removed by an automatic film removing machine, the surface of the wafer is easily contaminated by contact with the manipulator, and the automatic film removing equipment is expensive, inefficient and narrow in scope of application. Currently, it is only suitable for wafers with a diameter of more than 150 mm and a thickness of more than 400 μm.

When peeling off the film manually, the operator wears gloves and uses fingers across the wafer surface to hold the edge of the wafer, leaving glove marks easily, resulting in edge contamination of the wafer, and prone to deformation, which affects the quality of the wafer, and is not suitable for wafers with larger diameters

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